Invention Application
- Patent Title: ORBITAL POLISHING WITH SMALL PAD
- Patent Title (中): ORBITAL POLISHING WITH SMAD PAD
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Application No.: US14334608Application Date: 2014-07-17
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Publication No.: US20160016280A1Publication Date: 2016-01-21
- Inventor: Hung Chih Chen , Paul D. Butterfield , Jay Gurusamy , Jason Garcheung Fung , Shou-Sung Chang , Jimin Zhang , Eric Lau
- Applicant: Applied Materials, Inc.
- Main IPC: B24B37/10
- IPC: B24B37/10 ; H01L21/768 ; H01L21/67
Abstract:
A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.
Public/Granted literature
- US10076817B2 Orbital polishing with small pad Public/Granted day:2018-09-18
Information query
