公开(公告)号：US20220293397A1

公开(公告)日：2022-09-15

申请号：US17198141

申请日：2021-03-10

Applicant: Applied Materials, Inc.

Inventor： Michael R. RICE ,  Kenneth S. COLLINS ,  James David CARDUCCI ,  Shahid RAUF ,  Kartik RAMASWAMY

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: Embodiments of substrates supports for use in process chambers are provided herein. In some embodiments, a substrate support includes: a dielectric plate having a first side configured to support a substrate having a given diameter and including an annular groove disposed in the first side, wherein the annular groove has an inner diameter that is less than the given diameter and an outer diameter that is greater than the given diameter, wherein the dielectric plate includes a chucking electrode; an insert ring disposed in the annular groove of the dielectric plate; and an edge ring disposed on the dielectric plate, wherein the edge ring has an inner diameter that is greater than the given diameter and less than the outer diameter of the annular groove such that the edge ring is disposed over a portion of the insert ring.

公开(公告)号：US20230197495A1

公开(公告)日：2023-06-22

申请号：US17553305

申请日：2021-12-16

Applicant: Applied Materials, Inc.

Inventor： James David CARDUCCI ,  Kenneth S. COLLINS ,  Michael R. RICE ,  Kartik RAMASWAMY ,  Silverst Antony RODRIGUES ,  Yang YANG

IPC: H01L21/683 ,  H01L21/687 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01L21/68742 ,  H01L21/68735 ,  H01J37/32724 ,  H01J37/32642 ,  H01J37/32834 ,  H01J2237/334

Abstract: Embodiments of substrate supports for use in substrate processing chambers are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes: a pedestal having a first side configured to support a substrate and a second side opposite the first side; a plurality of substrate lift pins extending through the pedestal, wherein a plurality of first gaps are disposed between the plurality of substrate lift pins and respective ones of a plurality of substrate lift pin openings in the pedestal; and vacuum lines that extend from the plurality of substrate lift pin openings and that are configured to pump down the plurality of substrate lift pin openings.

公开(公告)号：US20190115246A1

公开(公告)日：2019-04-18

申请号：US15843697

申请日：2017-12-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik RAMASWAMY ,  Kenneth S. COLLINS ,  Michael R. RICE ,  James David CARDUCCI

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: Apparatus for shielding a substrate support in a semiconductor processing chamber. In some embodiments, the apparatus includes: a substrate support body with a substrate processing surface, a feedthrough assembly for supporting the substrate support body in the semiconductor processing chamber, and a conductive member that provides a conductive path from a lowermost portion of the feedthrough assembly to the substrate processing surface of the substrate support body. The conductive member is disposed symmetrically about the substrate support.