公开(公告)号：US20220301920A1

公开(公告)日：2022-09-22

申请号：US17832775

申请日：2022-06-06

Applicant: Applied Materials, Inc.

Inventor： Kin Pong LO ,  Vladimir NAGORNY ,  Wei LIU ,  Theresa Kramer GUARINI ,  Bernard L. HWANG ,  Malcolm J. BEVAN ,  Jacob ABRAHAM ,  Swayambhu Prasad BEHERA

IPC: H01L21/687 ,  H01J37/32 ,  C23C16/455 ,  H01L21/67 ,  C23C16/458

Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.

公开(公告)号：US20220028656A1

公开(公告)日：2022-01-27

申请号：US16939898

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Kin Pong LO ,  Vladimir NAGORNY ,  Wei LIU ,  Theresa Kramer GUARINI ,  Bernard L. HWANG ,  Malcolm J. BEVAN ,  Jacob ABRAHAM ,  Swayambhu Prasad BEHERA

IPC: H01J37/32 ,  H01L21/67 ,  C23C16/455

Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.