公开(公告)号：US20240352584A1

公开(公告)日：2024-10-24

申请号：US18618937

申请日：2024-03-27

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsuan WU ,  Teng Mao WANG ,  Yan-Chi PAN ,  Yi-Jiun SHIU ,  Jrjyan Jerry CHEN ,  Cheng-yuan LIN ,  Hsiao-Ling YANG ,  Yu-Min WANG ,  Wen-Hao WU

IPC: C23C16/455

CPC classification number: C23C16/45559

Abstract: The present disclosure generally provides an apparatus and method for gas diffuser support structure for a vacuum chamber. The gas diffuser support structure comprises a backing plate having a central bore, and a gas deflector having a length and a width unequal to the length coupled to the backing plate by a plurality of outward fasteners coupled to a plurality of outward threaded holes formed in the backing plate, in which a spacer is disposed between the backing plate and the gas deflector, and in which a length to width ratio of the gas deflector is about 0.1:1 to about 10:1.

公开(公告)号：US20200098549A1

公开(公告)日：2020-03-26

申请号：US16143280

申请日：2018-09-26

Applicant: Applied Materials, Inc.

Inventor： Beom Soo PARK ,  Robin L. TINER ,  Jianheng LI ,  Sang Jeong OH ,  Lai ZHAO ,  Gaku FURUTA ,  Soo Young CHOI ,  Jeevan Prakash SEQUEIRA ,  Wei-Ting CHEN ,  Hsiao-Ling YANG ,  Cheng-Hang HSU ,  Won Ho SUNG ,  Hyun Young HONG

IPC: H01J37/32 ,  C23C16/505

Abstract: A plasma processing chamber includes a chamber body and a lid assembly coupled to the chamber body to define a processing volume. The lid assembly includes a backing plate coupled to the chamber body, a diffuser with a plurality of openings formed therethrough, and a heat conductive spacer disposed between and coupled to the backing plate and the diffuser to transfer heat from the diffuser to the backing plate. The plasma processing chamber further includes a substrate support disposed within the processing volume.