公开(公告)号：US12131934B2

公开(公告)日：2024-10-29

申请号：US17063334

申请日：2020-10-05

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/67 ,  G01L9/08 ,  H01J37/32 ,  H01L21/68 ,  H04Q9/00 ,  H01L21/683

CPC classification number: H01L21/68 ,  G01L9/08 ,  H01J37/32724 ,  H04Q9/00 ,  H01J2237/20264 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/6838

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

公开(公告)号：US20220108907A1

公开(公告)日：2022-04-07

申请号：US17063334

申请日：2020-10-05

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/68 ,  H01J37/32 ,  H04Q9/00 ,  G01L9/08

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

公开(公告)号：US11848218B2

公开(公告)日：2023-12-19

申请号：US17077711

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Katty Guyomard ,  Chidambara A. Ramalingam ,  Shawyon Jafari ,  Palash Joshi ,  Moin Ahmed Khan ,  Kirubanandan Naina Shanmugam ,  Subhaschandra Shreepad Salkod ,  Avishek Ghosh ,  David W. Groechel ,  Li Wu ,  Dorothea Buechel-Rimmel

IPC: H01L21/67 ,  B08B3/04

CPC classification number: H01L21/67057 ,  B08B3/048

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

公开(公告)号：US20220130692A1

公开(公告)日：2022-04-28

申请号：US17077711

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Katty Guyomard ,  Chidambara A. Ramalingam ,  Shawyon Jafari ,  Palash Joshi ,  Moin Ahmed Khan ,  Kirubanandan Naina Shanmugam ,  Subhaschandra Shreepad Salkod ,  Avishek Ghosh ,  David W. Groechel ,  Li Wu ,  Dorothea Buechel-Rimmel

IPC: H01L21/67 ,  B08B3/04

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

公开(公告)号：US20250054797A1

公开(公告)日：2025-02-13

申请号：US18929425

申请日：2024-10-28

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/68 ,  G01L9/08 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H04Q9/00

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.