公开(公告)号：US12249525B1

公开(公告)日：2025-03-11

申请号：US18680896

申请日：2024-05-31

Applicant: Applied Materials, Inc.

Inventor： Ian McDonald ,  Prashant Aji ,  Chengqing Wang ,  Shifang Li ,  Xinyuan Chong

IPC: H01L21/67 ,  H01L21/66

Abstract: Systems, methods, and computer-readable mediums for monitoring temperature of a substrate are described. Spectroscopic measurements are performed on a surface of the substrate using a metrology tool integrated with a processing tool. The measurements may be used to determine that the substrate has cooled below a threshold temperature using the spectroscopic measurements.

公开(公告)号：US20230317481A1

公开(公告)日：2023-10-05

申请号：US17710779

申请日：2022-03-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Shifang Li ,  Yudong Hao ,  Xinyuan Chong ,  Chengqing Wang

IPC: H01L21/67 ,  H01L21/66 ,  G01K15/00

CPC classification number: H01L21/67248 ,  H01L22/22 ,  G01K15/005

Abstract: Methods and systems for temperature-based metrology calibration at a manufacturing system are provided. First metrology data corresponding to one or more first temperatures associated with a substrate following a completion of one or more portions of a substrate process at a manufacturing system is obtained. Second metrology data corresponding to a second temperature associated with the substrate following the completion of the substrate process is determined in view of calibration data associated with the substrate. The second temperature is different from each of the one or more first temperatures. In response to a determination, in view of the second metrology data, that a modification criterion associated with the substrate process is satisfied, the substrate process recipe is modified.