公开(公告)号：US20220005723A1

公开(公告)日：2022-01-06

申请号：US17368134

申请日：2021-07-06

Applicant: Applied Materials, Inc.

Inventor： Hanish Kumar Panavalappil Kumarankutty ,  Sean M. Seutter ,  Sudhir R. Gondhalekar ,  Wendell Glenn Boyd, JR. ,  Badri Ramamurthi ,  Shekhar Athani ,  Anil Kumar Kalal ,  Jay Dee Pinson, II

IPC: H01L21/683 ,  H01J37/32

Abstract: Embodiments of the disclosure provide electrostatic chucks for securing substrates during processing. Some embodiments of this disclosure provide methods and apparatus for increased temperature control across the radial profile of the substrate. Some embodiments of the disclosure provide methods and apparatus for providing control of hydrogen concentration in processed films during a high-density plasma (HDP) process.

公开(公告)号：US20250155883A1

公开(公告)日：2025-05-15

申请号：US18939065

申请日：2024-11-06

Applicant: Applied Materials, Inc.

Inventor： Prashanth Kothnur ,  Ala Moradian ,  Umesh Madhav Kelkar ,  Phillip Stout ,  Badri Ramamurthi ,  Karthik Ramanathan ,  Ananth Bhoj ,  Dalong Zhao

IPC: G05B19/418

Abstract: In one aspect of the present disclosure, a method includes obtaining, by a processing device, input data indicative of a first set of process parameters. The method further includes providing the input data to a first process model. The method further includes obtaining, from the first process model, first predictive output indicative of performance of a first process operation in accordance with the first set of process parameters. The method further includes providing the first predictive output to a second process model. The method further includes obtaining, from the second process model, second predictive output indicative of performance of a second process operation, different than the first process operation or a repetition of the first process operation, in accordance with the first set of process parameters. The method further includes performing a corrective action in view of the second predictive output.

公开(公告)号：US20210035781A1

公开(公告)日：2021-02-04

申请号：US16936071

申请日：2020-07-22

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar Pandey ,  Vinay Prabhakar ,  Bushra Afzal ,  Badri Ramamurthi ,  Juan C. Rocha

IPC: H01J37/32 ,  B08B7/00 ,  C23C16/44

Abstract: A processing chamber may include a gas distribution member, a metal ring member below the gas distribution member, and an isolating assembly coupled with the metal ring member and isolating the metal ring member from the gas distribution member. The isolating assembly may include an outer isolating member coupled with the metal ring member. The outer isolating member may at least in part define a chamber wall. The isolating assembly may further include an inner isolating member coupled with the outer isolating member. The inner isolating member may be disposed radially inward from the metal ring member about an central axis of the processing chamber. The inner isolating member may define a plurality of openings configured to provide fluid access into a radial gap between the metal ring member and the inner isolating member.