公开(公告)号：US10217721B2

公开(公告)日：2019-02-26

申请号：US15817066

申请日：2017-11-17

Applicant: Apple Inc.

Inventor： James D. Kelly ,  William H. Radke ,  Steven J. Sfarzo

IPC: H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  G11C11/417

Abstract: Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.

公开(公告)号：US20180323169A1

公开(公告)日：2018-11-08

申请号：US15817066

申请日：2017-11-17

Applicant: Apple Inc.

Inventor： James D. Kelly ,  William H. Radke ,  Steven J. Sfarzo

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/066 ,  G11C11/417 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2924/14361 ,  H05K1/0243

Abstract: Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.

公开(公告)号：US10804243B2

公开(公告)日：2020-10-13

申请号：US16243563

申请日：2019-01-09

Applicant: Apple Inc.

Inventor： James D. Kelly ,  William H. Radke ,  Steven J. Sfarzo

IPC: H05K7/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  G11C5/04 ,  G11C5/06 ,  G11C11/417 ,  H01L25/10 ,  H05K1/02

Abstract: Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.

公开(公告)号：US20190198480A1

公开(公告)日：2019-06-27

申请号：US16243563

申请日：2019-01-09

Applicant: Apple Inc.

Inventor： James D. Kelly ,  William H. Radke ,  Steven J. Sfarzo

IPC: H01L25/065 ,  G11C5/06 ,  H01L23/538 ,  G11C5/04 ,  H01L23/00

Abstract: Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.