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公开(公告)号:US09743522B2
公开(公告)日:2017-08-22
申请号:US13627989
申请日:2012-09-26
Applicant: Apple Inc.
Inventor: Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, Jr. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC classification number: H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
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2.
公开(公告)号:US20130235902A1
公开(公告)日:2013-09-12
申请号:US13726503
申请日:2012-12-24
Applicant: APPLE INC.
Inventor: Parin Patel , Scott P. Mullins
IPC: G01K13/00
CPC classification number: G01K13/00 , A61K31/56 , G01N33/5041 , G01N2500/00 , G06F1/206 , G06F1/32 , G06F1/3206 , H01M10/425 , H01M10/443 , H01M10/486 , H01M2010/4271 , H01M2010/4278 , Y02D10/16
Abstract: A power-management unit is described. This power-management unit allows a common signal line to communicate data between an integrated circuit (which may be external to the power-management unit) and a battery-monitoring mechanism in a battery pack, and to convey a signal that represents a temperature state of the battery pack to a temperature-monitoring circuit or mechanism that monitors the temperature state of the battery pack. In particular, the power-management unit may include a single-wire interface or a multiplexer that, at a given time, selectively couples the signal line from the battery pack either to the integrated circuit or the temperature-monitoring circuit based on a control signal provided by the integrated circuit (for example, via an I2C bus or interface). In this way, the power-management unit may reduce the number of signal lines needed to communicate with the battery-monitoring mechanism and to convey the signal.
Abstract translation: 描述电源管理单元。 该电力管理单元允许公共信号线在集成电路(其可以在电力管理单元的外部)与电池组中的电池监视机构之间通信数据,并且传达表示温度状态的信号 的电池组的温度监测电路或机构,其监测电池组的温度状态。 特别地,电源管理单元可以包括单线接口或多路复用器,其在给定时间,基于控制信号,将信号线从电池组选择性地耦合到集成电路或温度监视电路 由集成电路提供(例如,通过I2C总线或接口)。 以这种方式,电源管理单元可以减少与电池监视机构通信所需的信号线的数量并传送信号。
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公开(公告)号:US09797784B2
公开(公告)日:2017-10-24
申请号:US13726503
申请日:2012-12-24
Applicant: Apple Inc.
Inventor: Parin Patel , Scott P. Mullins
IPC: G01K1/12 , G01K1/14 , G01K13/00 , G06F1/20 , G06F1/32 , H01M10/42 , H01M10/48 , A61K31/56 , G01N33/50 , H01M10/44
CPC classification number: G01K13/00 , A61K31/56 , G01N33/5041 , G01N2500/00 , G06F1/206 , G06F1/32 , G06F1/3206 , H01M10/425 , H01M10/443 , H01M10/486 , H01M2010/4271 , H01M2010/4278 , Y02D10/16
Abstract: A power-management unit is described. This power-management unit allows a common signal line to communicate data between an integrated circuit (which may be external to the power-management unit) and a battery-monitoring mechanism in a battery pack, and to convey a signal that represents a temperature state of the battery pack to a temperature-monitoring circuit or mechanism that monitors the temperature state of the battery pack. In particular, the power-management unit may include a single-wire interface or a multiplexer that, at a given time, selectively couples the signal line from the battery pack either to the integrated circuit or the temperature-monitoring circuit based on a control signal provided by the integrated circuit (for example, via an I2C bus or interface). In this way, the power-management unit may reduce the number of signal lines needed to communicate with the battery-monitoring mechanism and to convey the signal.
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公开(公告)号:US09599519B2
公开(公告)日:2017-03-21
申请号:US13726506
申请日:2012-12-24
Applicant: Apple Inc.
Inventor: Parin Patel , Scott P. Mullins
CPC classification number: G01K13/00 , G01K1/022 , H02J7/00 , H02J7/0004 , H02J7/0091
Abstract: The described embodiments include a power-management unit that receives and stores a representation of a temperature state of a battery pack from a battery-monitoring mechanism in a battery pack. For example, an interface circuit (such as a single-wire-interface or SWI circuit) may receive the information from the battery-monitoring mechanism via a signal line, and the information may be stored in a memory (such as a non-transitory computer-readable memory). This stored information is then used by a temperature-monitoring mechanism or circuit to determine the temperature state of the battery pack, which may be used to control or gate charging of a battery in the battery pack.
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公开(公告)号:US20160223412A9
公开(公告)日:2016-08-04
申请号:US13726503
申请日:2012-12-24
Applicant: APPLE INC.
Inventor: Parin Patel , Scott P. Mullins
IPC: G01K13/00
CPC classification number: G01K13/00 , A61K31/56 , G01N33/5041 , G01N2500/00 , G06F1/206 , G06F1/32 , G06F1/3206 , H01M10/425 , H01M10/443 , H01M10/486 , H01M2010/4271 , H01M2010/4278 , Y02D10/16
Abstract: A power-management unit is described. This power-management unit allows a common signal line to communicate data between an integrated circuit (which may be external to the power-management unit) and a battery-monitoring mechanism in a battery pack, and to convey a signal that represents a temperature state of the battery pack to a temperature-monitoring circuit or mechanism that monitors the temperature state of the battery pack. In particular, the power-management unit may include a single-wire interface or a multiplexer that, at a given time, selectively couples the signal line from the battery pack either to the integrated circuit or the temperature-monitoring circuit based on a control signal provided by the integrated circuit (for example, via an I2C bus or interface). In this way, the power-management unit may reduce the number of signal lines needed to communicate with the battery-monitoring mechanism and to convey the signal.
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公开(公告)号:US20140085850A1
公开(公告)日:2014-03-27
申请号:US13627989
申请日:2012-09-26
Applicant: Apple Inc.
Inventor: Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, JR. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC classification number: H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
Abstract translation: 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入件安装到印刷电路板,并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。
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7.
公开(公告)号:US20130234652A1
公开(公告)日:2013-09-12
申请号:US13726506
申请日:2012-12-24
Applicant: APPLE INC.
Inventor: Parin Patel , Scott P. Mullins
CPC classification number: G01K13/00 , G01K1/022 , H02J7/00 , H02J7/0004 , H02J7/0091
Abstract: The described embodiments include a power-management unit that receives and stores a representation of a temperature state of a battery pack from a battery-monitoring mechanism in a battery pack. For example, an interface circuit (such as a single-wire-interface or SWI circuit) may receive the information from the battery-monitoring mechanism via a signal line, and the information may be stored in a memory (such as a non-transitory computer-readable memory). This stored information is then used by a temperature-monitoring mechanism or circuit to determine the temperature state of the battery pack, which may be used to control or gate charging of a battery in the battery pack.
Abstract translation: 所描述的实施例包括电力管理单元,其接收并存储来自电池组中的电池监视机构的电池组的温度状态的表示。 例如,接口电路(例如单线接口或SWI电路)可以经由信号线从电池监视机构接收信息,并且该信息可以存储在存储器中(诸如非暂时性的 计算机可读存储器)。 该存储的信息然后由温度监控机构或电路用于确定电池组的温度状态,其可用于控制或门电池中的电池充电。
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