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公开(公告)号:US12124297B2
公开(公告)日:2024-10-22
申请号:US17234363
申请日:2021-04-19
申请人: Apple Inc.
发明人: Sayooj R. Pillai , Annie T. Zhang , Lucas R. Compton , John V. Abram , Heather M. Martin , Timothy J. McHenry , Chi Zhang , Kienan D. McCarty , Lee B. Hamstra , Trevor M. Cardiff , Tristan Sansbury , Erik A. Uttermann , Kevin K. Mayer
CPC分类号: G06F1/1652 , G06F1/1637 , G06F1/1684 , G06F1/181 , G06F1/183 , H05K5/0217 , H05K5/0247 , H05K5/03
摘要: A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The portable electronic device can include a number of components that can provide desired functionalities and levels of performance. For example, the device can include one or more couplers that interconnect various portions of the housing together. Additionally or alternatively, the portable electronic device can include one or more millimeter-wave antennas. Additionally, or alternatively, the electronic device can include one or more grounding elements or layers that reliably and electrically ground the display to the housing.
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公开(公告)号:US11916311B2
公开(公告)日:2024-02-27
申请号:US17246290
申请日:2021-04-30
申请人: Apple Inc.
发明人: Lucas R. Compton
CPC分类号: H01Q9/0407 , G06F1/1698 , H01Q1/243 , H01Q1/48 , H01Q21/065 , H05K1/028 , H05K1/0393 , H05K5/0017 , H05K2201/053 , H05K2201/055 , H05K2201/10098
摘要: An electronic device may be provided with a conductive housing sidewall and a phased antenna array that conveys radio-frequency signals at frequencies greater than 10 GHz. Each antenna in the array may radiate through a respective aperture in the sidewall. The antenna module may include a folded flexible printed circuit having a first portion and a second portion that extends from an end of the first portion and that is folded with respect to the first portion. The antennas in the phased antenna array may have antenna resonating elements that are distributed between the first and second portions. Forming the antenna module from a folded flexible printed circuit in this way may serve to minimize the thickness of the antenna module, thereby allowing the antenna module to fit between a ledge of the sidewall and a rear housing wall without occupying excessive space within the device.
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公开(公告)号:US20230261363A1
公开(公告)日:2023-08-17
申请号:US17670020
申请日:2022-02-11
申请人: Apple Inc.
CPC分类号: H01Q1/243 , H05K5/0017 , H01Q15/14
摘要: An electronic device may be provided with a phased antenna array having a bent dielectric resonating element. The bent dielectric resonating element may have a first segment, a second segment nonparallel to the first segment, and an angled surface that couples the first segment to the second segment. One or more feed probes may be coupled to the first segment to excite the dielectric resonating element. A reflector may be provided on the angled surface to direct electromagnetic energy from the first segment to the second segment and vice versa. The bent dielectric resonating element may exhibit less overall height than dielectric resonators having straight columns of dielectric material, thereby allowing for a reduction in the thickness of the electronic device. The angled surface and the reflector may optimize the radio-frequency performance of the antenna despite the reduction in overall height.
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公开(公告)号:US20200089287A1
公开(公告)日:2020-03-19
申请号:US16134738
申请日:2018-09-18
申请人: Apple Inc.
发明人: Carli E. Oster , Chi Zhang , Haowei Wang , Lucas R. Compton
摘要: An electronic device may be provided with a display and conductive sidewalls. The display may include conductive display structures and a cover layer. The cover layer may be mounted to the sidewalls. The sidewalls may define antenna apertures for antennas in the device. Grounding structures may be coupled between the conductive display structures and the sidewalls at locations that at least partially overlap the antenna apertures. The grounding structures may include conductive tape having an adhesive surface. The conductive tape may have a first end at which the adhesive surface is coupled to the conductive display structures. The conductive tape may have a second end that is folded around a layer of heat-activated film and that is coupled to both the display cover layer and the conductive sidewalls. Conductive tape overlapping each antenna aperture may be concurrently assembled into the electronic device as the display is mounted to the sidewalls.
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公开(公告)号:US11824257B2
公开(公告)日:2023-11-21
申请号:US17669983
申请日:2022-02-11
申请人: Apple Inc.
CPC分类号: H01Q1/243 , H01Q1/38 , H01Q9/0485 , H01Q13/02
摘要: An electronic device may be provided with a phased antenna array that includes a dielectric resonator antenna having a dielectric column mounted to a circuit board. The dielectric column may be embedded in a dielectric substrate such as a plastic overmold. Conductive walls may be disposed on the dielectric substrate and may laterally surround the dielectric substrate and one or more dielectric resonating elements in the phased antenna array. The conductive walls may be grounded. The conductive walls may have a tapered shape. The conductive walls may help to isolate the antenna from electromagnetic influences from nearby conductive components in the electronic device. The conductive walls may form a conductive horn that helps to maximize the gain of the antenna in conveying radio-frequency signals greater than 10 GHz through a display cover layer, housing window, camera sapphire, or rear housing wall.
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公开(公告)号:US20230261362A1
公开(公告)日:2023-08-17
申请号:US17669983
申请日:2022-02-11
申请人: Apple Inc.
CPC分类号: H01Q1/243 , H01Q1/38 , H01Q9/0485 , H01Q13/02
摘要: An electronic device may be provided with a phased antenna array that includes a dielectric resonator antenna having a dielectric column mounted to a circuit board. The dielectric column may be embedded in a dielectric substrate such as a plastic overmold. Conductive walls may be disposed on the dielectric substrate and may laterally surround the dielectric substrate and one or more dielectric resonating elements in the phased antenna array. The conductive walls may be grounded. The conductive walls may have a tapered shape. The conductive walls may help to isolate the antenna from electromagnetic influences from nearby conductive components in the electronic device. The conductive walls may form a conductive horn that helps to maximize the gain of the antenna in conveying radio-frequency signals greater than 10 GHz through a display cover layer, housing window, camera sapphire, or rear housing wall.
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公开(公告)号:US20220352635A1
公开(公告)日:2022-11-03
申请号:US17246290
申请日:2021-04-30
申请人: Apple Inc.
发明人: Lucas R. Compton
摘要: An electronic device may be provided with a conductive housing sidewall and a phased antenna array that conveys radio-frequency signals at frequencies greater than 10 GHz. Each antenna in the array may radiate through a respective aperture in the sidewall. The antenna module may include a folded flexible printed circuit having a first portion and a second portion that extends from an end of the first portion and that is folded with respect to the first portion. The antennas in the phased antenna array may have antenna resonating elements that are distributed between the first and second portions. Forming the antenna module from a folded flexible printed circuit in this way may serve to minimize the thickness of the antenna module, thereby allowing the antenna module to fit between a ledge of the sidewall and a rear housing wall without occupying excessive space within the device.
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公开(公告)号:US20220295648A1
公开(公告)日:2022-09-15
申请号:US17234363
申请日:2021-04-19
申请人: Apple Inc.
发明人: Sayooj R. Pillai , Annie T. Zhang , Lucas R. Compton , John V. Abram , Heather M. Martin , Timothy J. McHenry , Chi Zhang , Kienan D. McCarty , Lee B. Hamstra , Trevor M. Cardiff , Tristan Sansbury , Erik A. Uttermann , Kevin K. Mayer
摘要: A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The portable electronic device can include a number of components that can provide desired functionalities and levels of performance. For example, the device can include one or more couplers that interconnect various portions of the housing together. Additionally or alternatively, the portable electronic device can include one or more millimeter-wave antennas. Additionally, or alternatively, the electronic device can include one or more grounding elements or layers that reliably and electrically ground the display to the housing.
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公开(公告)号:US11909101B2
公开(公告)日:2024-02-20
申请号:US17670020
申请日:2022-02-11
申请人: Apple Inc.
CPC分类号: H01Q1/243 , H01Q15/14 , H05K5/0017
摘要: An electronic device may be provided with a phased antenna array having a bent dielectric resonating element. The bent dielectric resonating element may have a first segment, a second segment nonparallel to the first segment, and an angled surface that couples the first segment to the second segment. One or more feed probes may be coupled to the first segment to excite the dielectric resonating element. A reflector may be provided on the angled surface to direct electromagnetic energy from the first segment to the second segment and vice versa. The bent dielectric resonating element may exhibit less overall height than dielectric resonators having straight columns of dielectric material, thereby allowing for a reduction in the thickness of the electronic device. The angled surface and the reflector may optimize the radio-frequency performance of the antenna despite the reduction in overall height.
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公开(公告)号:US11658404B2
公开(公告)日:2023-05-23
申请号:US17028871
申请日:2020-09-22
申请人: Apple Inc.
发明人: Lucas R. Compton
CPC分类号: H01Q1/38 , H01Q1/243 , H01Q9/0485 , H01Q9/42
摘要: An electronic device may be provided with a conductive sidewall and a phased antenna array having a dielectric resonator antenna aligned with an aperture in the conductive sidewall. A feed probe may excite the antenna to radiate through the aperture at a frequency greater than 10 GHz. The antenna may include an injection-molded plastic substrate that affixes the antenna to the peripheral conductive housing structures, thereby integrating the antenna into the conductive sidewall. A hole or other machining operation may be used to expose the feed probe through the injection-molded plastic substrate. Conductive interconnect structures may be inserted into the substrate and coupled to the feed probe. The interconnect structures may be soldered to a circuit board. The circuit board may be coupled to the feed probe through the interconnect structures. The circuit board may be mounted to a rear surface or a side surface of the injection-molded plastic substrate.
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