公开(公告)号：US20230266243A1

公开(公告)日：2023-08-24

申请号：US18108416

申请日：2023-02-10

Applicant: Apple Inc.

Inventor： Mark Alan Arbore ,  Matthew A. Terrel ,  Jason Pelc

IPC: G01N21/49

CPC classification number: G01N21/49 ,  G01N2021/4711

Abstract: Described here are optical sampling architectures and methods for operation thereof. An optical sampling architecture can be capable of emitting a launch sheet light beam towards a launch region and receiving a detection sheet light beam from a detection region. The launchregion can have one dimension that is elongated relative to another dimension. The detection region can also have one dimension elongated relative to another dimension such that the system can selectively accept light having one or more properties (e.g., angle of incidence, beam size, beam shape, etc.). In some examples, the elongated dimension of the detection region can be greater than the elongated dimension of the launch region. In some examples, the system can include an outcoupler array and associated components for creating a launch sheet light beam having light rays with different in-plane launch positions and/or in-plane launch angles.

公开(公告)号：US11525967B1

公开(公告)日：2022-12-13

申请号：US16582838

申请日：2019-09-25

Applicant: Apple Inc.

Inventor： Alfredo Bismuto ,  Mark Arbore ,  Jason Pelc ,  Hooman Abediasl ,  Andrea Trita

IPC: G02B6/42 ,  G02B6/02 ,  G02B6/00 ,  G02B6/293

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

公开(公告)号：US20220131340A1

公开(公告)日：2022-04-28

申请号：US17519355

申请日：2021-11-04

Applicant: Apple Inc.

Inventor： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

IPC: H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345

Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

公开(公告)号：US11156497B2

公开(公告)日：2021-10-26

申请号：US16651901

申请日：2018-09-25

Applicant: Apple Inc.

Inventor： Alfredo Bismuto ,  David I. Simon ,  Jason Pelc

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04

Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

公开(公告)号：US11835836B1

公开(公告)日：2023-12-05

申请号：US17015974

申请日：2020-09-09

Applicant: Apple Inc.

Inventor： Yi-Kuei Wu ,  Jason Pelc ,  Mark Alan Arbore ,  Thomas C. Greening ,  Matthew A. Terrel ,  Yongming Tu ,  Mohamed Mahmoud

IPC: G02F1/21

CPC classification number: G02F1/21 ,  G02F1/212

Abstract: Disclosed herein is an integrated photonics device including an on-chip wavelength stability monitor. The wavelength stability monitor may include one or more interferometric components, such as Mach-Zehnder interferometers and can be configured to select among the output signals from the interferometric components for monitoring the wavelength emitted by a corresponding photonic component, such as a light source. The selection may be based on a slope of the output signal and in some examples may correspond to a working zone at or around a wavelength or wavelength range. In some examples, the interferometric components can be configured with different phase differences such that the corresponding working zones have different wavelengths. In some examples, the slopes of the output signals may be weighted based on the steepness of the slope and all of the output signals may include information for wavelength locking the measured wavelength to the target wavelength.

公开(公告)号：US11713999B2

公开(公告)日：2023-08-01

申请号：US17484994

申请日：2021-09-24

Applicant: Apple Inc.

Inventor： Alfredo Bismuto ,  David I. Simon ,  Jason Pelc

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04

CPC classification number: G01J1/4257 ,  G01J1/0252 ,  G01J1/0425

Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

公开(公告)号：US11171464B1

公开(公告)日：2021-11-09

申请号：US16714575

申请日：2019-12-13

Applicant: Apple Inc.

Inventor： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

IPC: H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345 ,  G02B6/12 ,  H01S5/024

Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

公开(公告)号：US10823912B1

公开(公告)日：2020-11-03

申请号：US16582926

申请日：2019-09-25

Applicant: Apple Inc.

Inventor： Jason Pelc ,  Pat Wright ,  Peter L. D. Chang

IPC: G02B6/122 ,  G02B6/132 ,  G02B6/42 ,  G02B6/136 ,  G02B6/12

Abstract: Described herein is a top-side vertical outcoupler for use in an integrated photonics device. The integrated photonics device can include a photonics circuit, where light can propagate through waveguide(s) to outcoupler(s). The outcoupler(s) can redirect the light to optics, which can then collimate, focus, and/or direct the light to a launch region located on an external surface of the device. The integrated photonics device can include a plurality of layers deposited on a supporting layer. The plurality of layers can be used to form the waveguide(s) and the outcoupler(s). By forming the outcoupler(s) of the same material as the waveguide(s), the amount of light that is lost can be reduced or minimized. Additionally, the reduced number of interfaces that the light has to pass through to reach the outcoupler(s) can allow for better control of the divergence angles of the emitted light.

公开(公告)号：US12197020B2

公开(公告)日：2025-01-14

申请号：US18079672

申请日：2022-12-12

Applicant: Apple Inc.

Inventor： Alfredo Bismuto ,  Mark Arbore ,  Jason Pelc ,  Hooman Abediasl ,  Andrea Trita

IPC: G02B6/42 ,  G02B6/00 ,  G02B6/02 ,  G02B6/293

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

公开(公告)号：US20230251420A1

公开(公告)日：2023-08-10

申请号：US18134865

申请日：2023-04-14

Applicant: Apple Inc.

Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Lexie Nicole Schachne ,  Jason Pelc

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42

CPC classification number: G02B6/12004 ,  G02B6/122 ,  G02B6/4244 ,  G02B2006/12104 ,  G02B2006/12138

Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.