公开(公告)号：US20240068484A1

公开(公告)日：2024-02-29

申请号：US18225043

申请日：2023-07-21

Applicant: Apple Inc.

Inventor： Jesse T. DYBENKO ,  Arash NAGHIB LAHOUTI ,  Jason C. SAUERS ,  Jeffrey R. KAPPER ,  Sivesh SELVAKUMAR ,  David J. DUNSMOOR

IPC: F04D29/28 ,  F04D29/42 ,  F04D29/62 ,  F04D29/70

CPC classification number: F04D29/281 ,  F04D29/4226 ,  F04D29/626 ,  F04D29/703

Abstract: A head-mountable device can include a fan that effectively manages heat while also mitigating the intrusion of particles and other debris. Fans can include a protrusion that creates a tortuous pathway to direct incoming particles away from sensitive regions. Fans can include openings to allow particles to exit the fan enclosure and avoid interaction with the impeller. Fans can include a variable spacing between the impeller and the base plate to avoid collection of particles. Fans can include an adhesive pad that collects and retains particles at a location that does not interfere with rotation of the impeller.

公开(公告)号：US20190082563A1

公开(公告)日：2019-03-14

申请号：US16127055

申请日：2018-09-10

Applicant: Apple Inc.

Inventor： Melissa A. WAH ,  David J. DUNSMOOR

IPC: H05K9/00 ,  H05K5/02

Abstract: This application relates to a portable electronic device. According to some embodiments, a portable electronic device is described. The portable electronic device includes a magnetically-responsive operational component capable of executing a function. The portable electronic device further includes an electronic component that generates magnetic flux, where the magnetic is capable of interfering with the execution of the function by the magnetically-responsive operational component. The portable electronic device further includes a shielding plate that includes (i) a first nickel-iron layer that overlays a first surface of the shielding plate, and (ii) a second nickel-iron layer that overlays a second surface of the shielding plate, where the second surface is opposite the first surface, and the first and second nickel-iron layers are capable of shielding the magnetic flux away from the magnetically-responsive operational component.

公开(公告)号：US20180084680A1

公开(公告)日：2018-03-22

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. JARVIS ,  David A. PAKULA ,  David J. DUNSMOOR ,  Ian A. SPRAGGS ,  Lee E. HOOTON ,  Marwan RAMMAH ,  Matthew D. HILL ,  Robert F. MEYER ,  James A. BERTIN ,  Eric M. BENNETT ,  Simon C. HELMORE ,  Melissa A. WAH ,  Jon F. HOUSOUR ,  Douglas G. FOURNIER ,  Christopher S. TOMASETTA

IPC: H05K7/20

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K7/20963

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.