公开(公告)号：US20150160890A1

公开(公告)日：2015-06-11

申请号：US14457237

申请日：2014-08-12

Applicant: Apple Inc.

Inventor： Gil Semo ,  Asaf Bart ,  Avraham Poza Meir

IPC: G06F3/06 ,  G06F12/02

CPC classification number: G06F3/0688 ,  G06F3/0619 ,  G06F3/0658 ,  G06F11/1008 ,  G06F12/0246 ,  G06F2212/7208

Abstract: A device includes multiple memory devices, a bus splitter and a package. The bus splitter is configured to exchange storage commands and data with an external host using an external Input/Output (I/O) bus, and to distribute the storage commands and the data over multiple buses connected to respective subsets of the memory devices, so as to relay the storage commands and the data between the multiple memory devices and the external host. The memory devices and the bus splitter are contained in the package, in a multi-chip package (MCP) structure.

Abstract translation: 设备包括多个存储设备，总线分配器和封装。 总线分配器被配置为使用外部输入/输出（I / O）总线与外部主机交换存储命令和数据，并且通过连接到存储器设备的各个子集的多个总线来分配存储命令和数据，因此 用于中继存储命令和多个存储器件与外部主机之间的数据。 存储器件和总线分配器以多芯片封装（MCP）结构包含在封装中。