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公开(公告)号：US08745853B2
公开(公告)日：2014-06-10
申请号：US13176053
申请日：2011-07-05
申请人： Anthony Grbic , Carl Pfeiffer , Xin Xu , Stephen Forrest
发明人： Anthony Grbic , Carl Pfeiffer , Xin Xu , Stephen Forrest
IPC分类号： H01P11/00
CPC分类号： H01Q11/083 , H01Q1/38 , H01Q9/27 , H01Q11/08
摘要： Disclosed herein is a method of fabricating an antenna in which a flexible stamp is formed from a first wafer, the first wafer transferring a pattern to the flexible stamp, in which an antenna substrate is shaped into a three-dimensional contour with a second mold, in which the flexible stamp is positioned in the second mold to deform the flexible stamp into the three-dimensional contour, and in which a metallic layer on the flexible stamp is cold welded to create a set of antenna traces on the antenna substrate in accordance with the pattern. The antenna traces may then be electroplated.
摘要翻译： 本文公开了一种制造天线的方法，其中从第一晶片形成柔性印模，第一晶片将图案传送到柔性印模，其中天线基板用第二模具成形为三维轮廓， 其中柔性印模定位在第二模具中以将柔性印模变形成三维轮廓，并且其中柔性印版上的金属层被冷焊以在天线基板上产生一组天线迹线，根据 模式。 然后可以电镀天线迹线。
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公开(公告)号：US20140266975A1
公开(公告)日：2014-09-18
申请号：US14167402
申请日：2014-01-29
申请人： Anthony Grbic , Carl Pfeiffer , Xin Xu , Stephen Forrest
发明人： Anthony Grbic , Carl Pfeiffer , Xin Xu , Stephen Forrest
CPC分类号： H01Q1/36 , H01P11/00 , H01Q1/38 , H01Q9/27 , H01Q11/08 , H01Q11/083 , Y10T29/49016
摘要： An antenna includes a dielectric substrate having a three-dimensional contour, and a set of antenna traces on the dielectric substrate. Each antenna trace spirals around the three-dimensional contour in a helical pattern. Each antenna trace includes a plated metallic layer.
摘要翻译： 天线包括具有三维轮廓的电介质基片和电介质基片上的一组天线迹线。 每个天线迹线以螺旋图案围绕三维轮廓螺旋。 每个天线迹线包括镀金属层。
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公开(公告)号：US20120007791A1
公开(公告)日：2012-01-12
申请号：US13176053
申请日：2011-07-05
申请人： Anthony Grbic , Carl Pfeiffer , Xin Xu , Stephen Forrest
发明人： Anthony Grbic , Carl Pfeiffer , Xin Xu , Stephen Forrest
CPC分类号： H01Q11/083 , H01Q1/38 , H01Q9/27 , H01Q11/08
摘要： Disclosed herein is a method of fabricating an antenna in which a flexible stamp is formed from a first wafer, the first wafer transferring a pattern to the flexible stamp, in which an antenna substrate is shaped into a three-dimensional contour with a second mold, in which the flexible stamp is positioned in the second mold to deform the flexible stamp into the three-dimensional contour, and in which a metallic layer on the flexible stamp is cold welded to create a set of antenna traces on the antenna substrate in accordance with the pattern. The antenna traces may then be electroplated.
摘要翻译： 本文公开了一种制造天线的方法，其中从第一晶片形成柔性印模，第一晶片将图案传送到柔性印模，其中天线基板用第二模具成形为三维轮廓， 其中柔性印模定位在第二模具中，以将柔性印模变形成三维轮廓，并且其中柔性印模上的金属层被冷焊以在天线基板上产生一组天线迹线，根据 模式。 然后可以电镀天线迹线。
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4.发明授权System and method for depositing thin layers on non-planar substrates by stamping 有权通过冲压在非平面基板上沉积薄层的系统和方法公开(公告)号：US08631759B2
公开(公告)日：2014-01-21
申请号：US12697357
申请日：2010-02-01
申请人： Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
发明人： Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
CPC分类号： H01L51/0004 , B29D11/00807 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L51/0022
摘要： An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.
摘要翻译： 使用弹性体印模将材料沉积在非平面基底上。 使用真空模具来使弹性体印模变形，施加压力以将材料从印模转移到基底。 通过减小由真空模具施加的真空度，可以使用印模的弹性来施加该压力。 也可以通过向衬底和/或印模施加力来施加压力。 使用弹性体印记允许图案化层被沉积在非平面基板上，同时具有减小对图案化层的损伤的机会。
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公开(公告)号：US20130001731A1
公开(公告)日：2013-01-03
申请号：US13536003
申请日：2012-06-28
IPC分类号： H01L31/18 , H01L27/144
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L31/022408 , H01L31/0304 , H01L31/03926 , H01L31/075 , H01L31/1844 , H01L31/1892 , Y02E10/544 , Y02E10/548
摘要： A method of fabricating an optoelectronic device includes creating an optoelectronic structure on a first substrate. The optoelectronic structure includes a release layer and a plurality of inorganic semiconductor layers supported by the release layer. The plurality of inorganic semiconductor layers is configured to be active in operation of the optoelectronic device. The plurality of inorganic semiconductor layers are permanently attached to a second substrate, which is flexible. The plurality of inorganic semiconductor layers are released from the first substrate after the attaching step, and the second substrate is deformed to a non-planar configuration.
摘要翻译： 制造光电子器件的方法包括在第一衬底上产生光电子结构。 光电结构包括释放层和由释放层支撑的多个无机半导体层。 多个无机半导体层被配置为在光电子器件的操作中是有效的。 多个无机半导体层永久地附接到柔性的第二基板上。 在安装步骤之后，多个无机半导体层从第一基板释放，第二基板变形为非平面构造。
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6.发明申请SYSTEM AND METHOD FOR DEPOSITING THIN LAYERS ON NON-PLANAR SUBSTRATES BY STAMPING 审中-公开通过冲压在非平面基板上沉积薄层的系统和方法公开(公告)号：US20090020910A1
公开(公告)日：2009-01-22
申请号：US12186197
申请日：2008-08-05
申请人： Stephen Forrest , Xin Xu , Marcelo Davanco
发明人： Stephen Forrest , Xin Xu , Marcelo Davanco
IPC分类号： B29C45/16
CPC分类号： B29C45/16 , H01L51/0004 , H01L51/0022
摘要： An optoelectronic device may be fabricated on a three dimensional surface by transferring a material from an elastomeric stamp to a non-planar substrate. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer. The material may be deposited on the stamp while the stamp is in a planar configuration or after the stamp has been deformed to a shape generally the same as the shape of the non-planar substrate. The material may be transferred by cold welding. The device may include organic layers.
摘要翻译： 通过将材料从弹性体印模转移到非平面基底，可以在三维表面上制造光电子器件。 使用弹性体印记允许图案化层被沉积在非平面基板上，同时具有减小对图案化层的损伤的机会。 当印模处于平面构型或印模已经变形成与非平面基底的形状大致相同的形状时，材料可以沉积在印模上。 材料可以通过冷焊转移。 该装置可以包括有机层。
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公开(公告)号：US20150357366A1
公开(公告)日：2015-12-10
申请号：US14720312
申请日：2015-05-22
IPC分类号： H01L27/146 , H01L31/0224 , H01L31/075 , H01L31/0304
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L31/022408 , H01L31/0304 , H01L31/03926 , H01L31/075 , H01L31/1844 , H01L31/1892 , Y02E10/544 , Y02E10/548
摘要： A device includes a three-dimensionally curved substrate, a patterned metal layer disposed on the curved substrate, and an array of optoelectronic devices, each optoelectronic device including an optoelectronic structure supported by the curved substrate. Each optoelectronic structure includes an inorganic semiconductor stack. The device further includes a set of contact stripes extending across the curved substrate, each optoelectronic structure being coupled to a respective contact stripe of the set of contact stripes. The array of optoelectronic devices is secured to the curved substrate via a bond between the patterned metal layer and the set of contact stripes.
摘要翻译： 一种器件包括三维弯曲的衬底，设置在弯曲衬底上的图案化金属层和光电器件阵列，每个光电器件包括由弯曲衬底支撑的光电结构。 每个光电子结构包括无机半导体堆叠。 该装置还包括跨越弯曲基板延伸的一组接触条，每个光电子结构耦合到该组接触条的相应接触条。 光电子器件的阵列通过图案化的金属层和一组接触条之间的接合固定到弯曲的基底上。
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公开(公告)号：US09065010B2
公开(公告)日：2015-06-23
申请号：US13536003
申请日：2012-06-28
IPC分类号： H01L21/00 , H01L31/18 , H01L27/144 , H01L31/0392 , H01L31/075
CPC分类号： H01L27/14643 , H01L27/1446 , H01L27/14618 , H01L27/14636 , H01L31/022408 , H01L31/0304 , H01L31/03926 , H01L31/075 , H01L31/1844 , H01L31/1892 , Y02E10/544 , Y02E10/548
摘要： A method of fabricating an optoelectronic device includes creating an optoelectronic structure on a first substrate. The optoelectronic structure includes a release layer and a plurality of inorganic semiconductor layers supported by the release layer. The plurality of inorganic semiconductor layers is configured to be active in operation of the optoelectronic device. The plurality of inorganic semiconductor layers are permanently attached to a second substrate, which is flexible. The plurality of inorganic semiconductor layers are released from the first substrate after the attaching step, and the second substrate is deformed to a non-planar configuration.
摘要翻译： 制造光电子器件的方法包括在第一衬底上产生光电子结构。 光电结构包括释放层和由释放层支撑的多个无机半导体层。 多个无机半导体层被配置为在光电子器件的操作中是有效的。 多个无机半导体层永久地附接到柔性的第二基板上。 在安装步骤之后，多个无机半导体层从第一基板释放，第二基板变形为非平面构造。
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9.发明申请System and Method for Depositing Thin Layers on Non-Planar Substrates by Stamping 有权通过冲压在非平面基板上沉积薄层的系统和方法公开(公告)号：US20100189837A1
公开(公告)日：2010-07-29
申请号：US12697357
申请日：2010-02-01
申请人： Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
发明人： Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
IPC分类号： B29C51/10
CPC分类号： H01L51/0004 , B29D11/00807 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L51/0022
摘要： An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.
摘要翻译： 使用弹性体印模将材料沉积在非平面基底上。 使用真空模具来使弹性体印模变形，施加压力以将材料从印模转移到基底。 通过减小由真空模具施加的真空度，可以使用印模的弹性来施加该压力。 也可以通过向衬底和/或印模施加力来施加压力。 使用弹性体印记允许图案化层被沉积在非平面基板上，同时具有减小对图案化层的损伤的机会。
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公开(公告)号：US10243018B2
公开(公告)日：2019-03-26
申请号：US14720312
申请日：2015-05-22
IPC分类号： H01L31/00 , H01L27/146 , H01L31/0304 , H01L31/0224 , H01L27/144 , H01L31/0392 , H01L31/075 , H01L31/18
摘要： A device includes a three-dimensionally curved substrate, a patterned metal layer disposed on the curved substrate, and an array of optoelectronic devices, each optoelectronic device including an optoelectronic structure supported by the curved substrate. Each optoelectronic structure includes an inorganic semiconductor stack. The device further includes a set of contact stripes extending across the curved substrate, each optoelectronic structure being coupled to a respective contact stripe of the set of contact stripes. The array of optoelectronic devices is secured to the curved substrate via a bond between the patterned metal layer and the set of contact stripes.
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