公开(公告)号：US6132653A

公开(公告)日：2000-10-17

申请号：US293030

申请日：1999-04-16

Applicant: Andrew T. Hunt ,  Helmut G. Hornis

Inventor： Andrew T. Hunt ,  Helmut G. Hornis

IPC: H05H1/24 ,  B05D1/02 ,  B22F9/28 ,  C01B13/34 ,  C23C16/44 ,  C23C16/448 ,  C23C16/453 ,  B29B9/00

CPC classification number: C23C16/453 ,  B22F9/28 ,  C01B13/34 ,  C23C16/4486 ,  B05D1/08 ,  B05D2401/90 ,  Y02P20/544 ,  Y02T50/67 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/265

Abstract: A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coating is deposited onto a substrate. The combustion flame can be stable from 10 torr to multiple atmospheres, and provides the energetic environment in which the reagent contained within the fluid can be reacted to form the desired powder or coating material on a substrate. The plasma torch likewise produces the required energy environment, but, unlike the flame, no oxidizer is needed so materials stable in only very low oxygen partial pressures can be formed. Using either the plasma torch or the combustion plasma, coatings can be deposited and powders formed in the open atmosphere without the necessity of a reaction chamber, but a chamber may be used for various reasons including process separation from the environment and pressure regulation.

公开(公告)号：US5997956A

公开(公告)日：1999-12-07

申请号：US691853

申请日：1996-08-02

Applicant: Andrew T. Hunt ,  Helmut G. Hornis

Inventor： Andrew T. Hunt ,  Helmut G. Hornis

IPC: H05H1/24 ,  B05D1/02 ,  B22F9/28 ,  C01B13/34 ,  C23C16/44 ,  C23C16/448 ,  C23C16/453

CPC classification number: C23C16/453 ,  B22F9/28 ,  C01B13/34 ,  C23C16/4486 ,  B05D1/08 ,  B05D2401/90 ,  Y02P20/544 ,  Y02T50/67 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/265

Abstract: A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coating is deposited onto a substrate. The combustion flame can be stable from 10 torr to multiple atmospheres, and provides the energetic environment in which the reagent contained within the fluid can be reacted to form the desired powder or coating material on a substrate. The plasma torch likewise produces the required energy environment, but, unlike the flame, no oxidizer is needed so materials stable in only very low oxygen partial pressures can be formed. Using either the plasma torch or the combustion plasma, coatings can be deposited and powders formed in the open atmosphere without the necessity of a reaction chamber, but a chamber may be used for various reasons including process separation from the environment and pressure regulation.

公开(公告)号：US06433993B1

公开(公告)日：2002-08-13

申请号：US09283100

申请日：1999-03-31

Applicant: Andrew T. Hunt ,  Wen-Yi Lin ,  Tzyy Jiuan Hwang ,  Michelle Hendrick ,  Helmut G. Hornis

Inventor： Andrew T. Hunt ,  Wen-Yi Lin ,  Tzyy Jiuan Hwang ,  Michelle Hendrick ,  Helmut G. Hornis

IPC: H01G4005

CPC classification number: H01G4/085 ,  H05K1/162 ,  H05K3/388 ,  H05K3/467 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309

Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

公开(公告)号：US06207522B1

公开(公告)日：2001-03-27

申请号：US09198285

申请日：1998-11-23

Applicant: Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Wen-Yi Lin

Inventor： Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Wen-Yi Lin

IPC: H01L2120

CPC classification number: H05K1/162 ,  H01G4/085 ,  H05K3/388 ,  H05K3/467 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309

Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

Abstract translation: 薄层电容器由第一柔性金属层，沉积在其上的约0.03和约2微米之间的电介质层和沉积在电介质层上的第二柔性金属层形成。 第一柔性金属层可以是金属箔，例如铜，铝或镍箔，或者沉积在聚合物支撑片上的金属层。 通过燃烧化学气相沉积或受控气氛化学气相沉积，这些层的沉积是或通过其促进的。

公开(公告)号：US06793975B2

公开(公告)日：2004-09-21

申请号：US09921437

申请日：2001-08-03

Applicant: Andrew T. Hunt ,  Helmut G. Hornis

Inventor： Andrew T. Hunt ,  Helmut G. Hornis

IPC: C23C400

CPC classification number: C23C16/453 ,  B05D1/08 ,  B05D2401/90 ,  B22F9/28 ,  C01B13/34 ,  C23C16/4486 ,  Y02P20/544 ,  Y02T50/67 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/265

Abstract: A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coating is deposited onto a substrate. The combustion flame can be stable from 10 torr to multiple atmospheres, and provides the energetic environment in which the reagent contained within the fluid can be reacted to form the desired powder or coating material on a substrate. The plasma torch likewise produces the required energy environment, but, unlike the flame, no oxidizer is needed so materials stable in only very low oxygen partial pressures can be formed. Using either the plasma torch or the combustion plasma, coatings can be deposited and powders formed in the open atmosphere without the necessity of a reaction chamber, but a chamber may be used for various reasons including process separation from the environment and pressure regulation.

Abstract translation: 使用在其超临界温度附近含有液体或液体状流体的试剂非常精细的雾化或蒸发的化学气相沉积方法，其中所得雾化或蒸发的溶液进入火焰或等离子体焰炬，并形成粉末 或涂层沉积在基底上。 燃烧火焰可以从10托稳定到多个大气压，并且提供能够使流体中包含的试剂反应以在基底上形成所需粉末或涂层材料的能量环境。 等离子体焰炬同样产生所需的能量环境，但是与火焰不同，不需要氧化剂，因此可以形成仅在非常低的氧分压下稳定的材料。 使用等离子体焰炬或燃烧等离子体，可以沉积涂层并且在开放气氛中形成粉末，而不需要反应室，但是可以由于各种原因使用室，包括与环境的分离和压力调节。

公开(公告)号：US06728092B2

公开(公告)日：2004-04-27

申请号：US09733815

申请日：2001-03-30

Applicant: Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Wen-Yi Lin

Inventor： Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Wen-Yi Lin

IPC: H01G4005

CPC classification number: H05K1/162 ,  H01G4/085 ,  H05K3/388 ,  H05K3/467 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309

Abstract: Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

Abstract translation: 薄层电容器由第一柔性金属层，沉积在其上的约0.03和约2微米之间的电介质层和沉积在电介质层上的第二柔性金属层形成。 第一柔性金属层可以是金属箔，例如铜，铝或镍箔，或者沉积在聚合物支撑片上的金属层。 通过燃烧化学气相沉积或受控气氛化学气相沉积，这些层的沉积是或通过其促进的。

公开(公告)号：US06193911B1

公开(公告)日：2001-02-27

申请号：US09069640

申请日：1998-04-29

Applicant: Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Hong Shao ,  Joe Thomas ,  Wen-Yi Lin ,  Shara S. Shoup ,  Henry A. Luten ,  John Eric McEntyre

Inventor： Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Hong Shao ,  Joe Thomas ,  Wen-Yi Lin ,  Shara S. Shoup ,  Henry A. Luten ,  John Eric McEntyre

IPC: H01B106

CPC classification number: H01L28/20 ,  C23C16/40 ,  C23C16/453 ,  H01C7/006 ,  H01C17/20 ,  H01C17/2416 ,  H05K1/167 ,  H05K3/064 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0338 ,  H05K2203/1338

Abstract: Precursor solutions are provided to produce thin film resistive materials by combustion chemical vapor deposition (CCVD) or controlled atmosphere combustion chemical vapor deposition (CACCVD). The resistive material may be a mixture of a zero valence metal and a dielectric material, or the resistive materials may be a conductive oxide.

Abstract translation: 提供前驱体解决方案以通过燃烧化学气相沉积（CCVD）或受控气氛燃烧化学气相沉积（CACCVD）来生产薄膜电阻材料。 电阻材料可以是零价金属和电介质材料的混合物，或者电阻材料可以是导电氧化物。