公开(公告)号：US09661408B2

公开(公告)日：2017-05-23

申请号：US14880140

申请日：2015-10-09

Applicant: Analog Devices, Inc.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H04R9/08 ,  H04R1/02 ,  B81B7/00 ,  H01L29/84 ,  H01L23/053

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

公开(公告)号：US20160105737A1

公开(公告)日：2016-04-14

申请号：US14880140

申请日：2015-10-09

Applicant: Analog Devices, Inc.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H04R1/02

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

Abstract translation: 可以使用三维打印技术来形成麦克风包。 麦克风封装可以包括具有第一侧和与第一侧相对的第二侧的壳体。 第一电引线可以形成在壳体的第一侧上的外表面上。 第二电引线可以形成在壳体的第二侧的外表面上。 第一电引线和第二电引线可以彼此电短路。 此外，垂直和水平导体可以整体地集成在壳体内。

公开(公告)号：US09156680B2

公开(公告)日：2015-10-13

申请号：US13662350

申请日：2012-10-26

Applicant: Analog Devices, Inc.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H01L29/84 ,  B81B7/00 ,  H01L23/053

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

Abstract translation: 可以使用三维打印技术来形成麦克风包。 麦克风封装可以包括具有第一侧和与第一侧相对的第二侧的壳体。 第一电引线可以形成在壳体的第一侧上的外表面上。 第二电引线可以形成在壳体的第二侧的外表面上。 第一电引线和第二电引线可以彼此电短路。 此外，垂直和水平导体可以整体地集成在壳体内。

公开(公告)号：US20140117473A1

公开(公告)日：2014-05-01

申请号：US13662350

申请日：2012-10-26

Applicant: ANALOG DEVICES, INC.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H01L29/84 ,  H01L21/56 ,  H01L21/50

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

Abstract translation: 可以使用三维打印技术来形成麦克风包。 麦克风封装可以包括具有第一侧和与第一侧相对的第二侧的壳体。 第一电引线可以形成在壳体的第一侧上的外表面上。 第二电引线可以形成在壳体的第二侧的外表面上。 第一电引线和第二电引线可以彼此电短路。 此外，垂直和水平导体可以整体地集成在壳体内。

公开(公告)号：US20170257687A1

公开(公告)日：2017-09-07

申请号：US15600148

申请日：2017-05-19

Applicant: ANALOG DEVICES, INC.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H04R1/02 ,  B81B7/00

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.