Invention Application
- Patent Title: PACKAGES AND METHODS FOR PACKAGING
- Patent Title (中): 包装和包装方法
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Application No.: US13662350Application Date: 2012-10-26
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Publication No.: US20140117473A1Publication Date: 2014-05-01
- Inventor: Oliver J. Kierse , Christian Lillelund
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: ANALOG DEVICES, INC.
- Current Assignee: ANALOG DEVICES, INC.
- Current Assignee Address: US MA Norwood
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/56 ; H01L21/50
Abstract:
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.
Public/Granted literature
- US09156680B2 Packages and methods for packaging Public/Granted day:2015-10-13
Information query
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