公开(公告)号：US20170022336A1

公开(公告)日：2017-01-26

申请号：US15284024

申请日：2016-10-03

申请人： Akron Polymers Systems, Inc.

发明人： Limin Sun ,  Frank W. Harris ,  Jiaokai Jing ,  Haci B. Erdem ,  John D. Harvey ,  Dong Zhang

IPC分类号： C08J5/18 ,  C08G69/32 ,  B32B17/06 ,  B29C35/02 ,  B29C39/14 ,  B32B27/34

CPC分类号： C08J5/18 ,  B29C35/02 ,  B29C39/14 ,  B29C41/24 ,  B29K2077/00 ,  B29K2077/10 ,  B29K2995/0026 ,  B29L2007/008 ,  B29L2031/3475 ,  B32B17/064 ,  B32B27/34 ,  B32B2457/206 ,  C08G69/32 ,  C08J2377/10 ,  C09D177/10 ,  Y10T428/24975 ,  Y10T428/265

摘要： The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

摘要翻译： 本发明涉及由玻璃化转变温度大于300℃的可溶性芳族共聚酰胺制备的透明膜。使用N，N-二甲基乙酰胺（DMAc），N-甲基-2 - 吡咯烷酮（NMP）或其它极性溶剂。 膜在接近共聚物玻璃化转变温度的温度下热固化。 固化后，聚合物膜的透光率从400〜750nm显示> 80％，热膨胀系数小于20ppm，耐溶剂性。 这些膜可用作微电子器件的柔性基板。

公开(公告)号：US20220267539A1

公开(公告)日：2022-08-25

申请号：US17360733

申请日：2021-06-28

申请人： Akron Polymers Systems, Inc.

发明人： Limin Sun ,  Frank W. Harris ,  Jiaokai Jing ,  Haci B. Erdem ,  John D. Harvey ,  Dong Zhang

IPC分类号： C08J5/18 ,  B32B27/34 ,  C08G69/32 ,  C09D177/10 ,  B32B17/10 ,  B32B17/06 ,  B29C41/24 ,  B29C35/02 ,  B29C39/14

摘要： The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

公开(公告)号：US11046825B2

公开(公告)日：2021-06-29

申请号：US15284024

申请日：2016-10-03

申请人： Akron Polymers Systems, Inc.

发明人： Limin Sun ,  Frank W. Harris ,  Jiaokai Jing ,  Haci B. Erdem ,  John D. Harvey ,  Dong Zhang

IPC分类号： C08G69/32 ,  C08J5/18 ,  B32B27/34 ,  C09D177/10 ,  B29C41/24 ,  B29C35/02 ,  B29C39/14 ,  B32B17/06 ,  B29K77/00 ,  B29L7/00 ,  B29L31/34

摘要： The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.