公开(公告)号：US11545426B2

公开(公告)日：2023-01-03

申请号：US17151066

申请日：2021-01-15

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yi Chun Chou

IPC分类号： H01L23/49 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/22 ,  H01L23/66

摘要： The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

公开(公告)号：US11955419B2

公开(公告)日：2024-04-09

申请号：US18092922

申请日：2023-01-03

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yi Chun Chou

IPC分类号： H01L21/48 ,  H01L23/49 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22

CPC分类号： H01L23/49838 ,  H01L21/4846 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01L2223/6677

摘要： The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

公开(公告)号：US20220230950A1

公开(公告)日：2022-07-21

申请号：US17151066

申请日：2021-01-15

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yi Chun Chou

IPC分类号： H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L21/48 ,  H01Q1/22

摘要： The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.