公开(公告)号：US12068259B2

公开(公告)日：2024-08-20

申请号：US18121568

申请日：2023-03-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei Da Lin ,  Meng-Jen Wang ,  Hung Chen Kuo ,  Wen Jin Huang

IPC分类号： H01L23/552 ,  H01L21/3213 ,  H01L21/56 ,  H01L23/04 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/32131 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3114

摘要： A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

公开(公告)号：US11605598B2

公开(公告)日：2023-03-14

申请号：US16852256

申请日：2020-04-17

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei Da Lin ,  Meng-Jen Wang ,  Hung Chen Kuo ,  Wen Jin Huang

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H01L21/3213

摘要： A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.