- 专利标题： Semiconductor device package and method of manufacturing the same
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申请号： US18121568申请日： 2023-03-14
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公开(公告)号： US12068259B2公开(公告)日： 2024-08-20
- 发明人: Wei Da Lin , Meng-Jen Wang , Hung Chen Kuo , Wen Jin Huang
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： FOLEY & LARDNER LLP
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/3213 ; H01L21/56 ; H01L23/04 ; H01L23/31
摘要：
A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
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