公开(公告)号：US20240359403A1

公开(公告)日：2024-10-31

申请号：US18654030

申请日：2024-05-03

Applicant: ATSP Innovations, LLC

Inventor： Louis O. Vaught ,  Andreas A. Polycarpou ,  Saifur Rahman

IPC: B29C64/194 ,  B29C64/106 ,  B29C64/209 ,  B29C64/314 ,  B29K67/00 ,  B29K101/10 ,  B29K105/00 ,  B29K105/16 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

CPC classification number: B29C64/194 ,  B29C64/106 ,  B29C64/209 ,  B29C64/314 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29K2067/00 ,  B29K2101/10 ,  B29K2105/0014 ,  B29K2105/0032 ,  B29K2105/16

Abstract: A novel technology to create 3D-printed objects that are extremely temperature resistant, mechanically robust, ultra-low-wear, and exhibit self-healing behavior. The material can be manufactured in a wide variety of process conditions and even used as a high-strength adhesive, enabling hybrid fabrication strategies. The gel precursor for this material is formed from two solids that react to create a high-performance polymer when heated. Unlike similar materials, these are solid at room temperature and form a printable gel when dissolved in a solvent. Addition of a secondary solvent to this gel modifies the solubility and creates a super-saturated fluid with tunable rheology. Once the gel material has been printed, it is allowed to dry via forced convection. This removes the solvent and leaves only the uncured polymer precursors. After the majority of the solvent has been removed, the material is heated to its cure temperature, at which point it melts, cures, and re-hardens. This process is then repeated for each subsequent layer deposited.