公开(公告)号：US20170339784A1

公开(公告)日：2017-11-23

申请号：US15534897

申请日：2015-12-10

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Andreas Zluc ,  Gerald Weidinger ,  Mario Schober ,  Hannes Stahr ,  Timo Schwarz ,  Benjamin Gruber

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H01L23/538

CPC classification number: H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

公开(公告)号：US09967972B2

公开(公告)日：2018-05-08

申请号：US15534897

申请日：2015-12-10

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Andreas Zluc ,  Gerald Weidinger ,  Mario Schober ,  Hannes Stahr ,  Timo Schwarz ,  Benjamin Gruber

IPC: H05K1/03 ,  H05K1/00 ,  B32B15/08 ,  H05K1/02 ,  H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H01L21/48 ,  H01L23/14 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.