公开(公告)号：US11977326B2

公开(公告)日：2024-05-07

申请号：US17048875

申请日：2019-04-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Dennis De Graaf ,  Richard Beaudry ,  Maxime Biron ,  Paul Janssen ,  Thijs Kater ,  Kevin Kornelsen ,  Michael Alfred Josephus Kuijken ,  Jan Hendrik Willem Kuntzel ,  Stephane Martel ,  Maxim Aleksandrovich Nasalevich ,  Guido Salmaso ,  Pieter-Jan Van Zwol

IPC: G03F1/64 ,  G03F1/62 ,  G03F7/00

CPC classification number: G03F1/64 ,  G03F1/62 ,  G03F7/70983

Abstract: A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidising environment. In any aspect, the pellicle may include a metal nitride layer.