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公开(公告)号：US11752701B2
公开(公告)日：2023-09-12
申请号：US17597913
申请日：2020-07-29
发明人： Rudolf Kaiser , Horst Lapsien
IPC分类号： B29C65/48 , B29C65/14 , B29C65/52 , B29C65/78 , B29K105/00
CPC分类号： B29C65/4845 , B29C65/1406 , B29C65/1496 , B29C65/524 , B29C65/782 , B29K2105/0097 , B29K2995/0026
摘要： The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.
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公开(公告)号：US20220274348A1
公开(公告)日：2022-09-01
申请号：US17597913
申请日：2020-07-29
发明人： Rudolf Kaiser , Horst Lapsien
摘要： The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.
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公开(公告)号：US12115736B2
公开(公告)日：2024-10-15
申请号：US17597912
申请日：2020-07-29
发明人： Rudolf Kaiser , Horst Lapsien
CPC分类号： B29C65/4845 , B29C65/524 , B29C65/782 , B29C65/7847
摘要： The invention relates to a bonding tool for a bonding device for bonding at least one component by adhesives to a substrate, the bonding device including a circular disc-shaped main body lying in a main plane and having an opening and a receiving head connected to the main body for receiving and holding the components, an orthogonal projection of the receiving head onto the main plane lying within the opening so that the receiving head is freely accessible through the opening. The bonding tool has a lighting unit integrated in the bonding tool for curing the adhesive. The invention also relates to a bonding device for bonding at least one component by adhesives applied to a substrate located in an assembly position, and to a bonding method for bonding components by adhesives applied to a substrate.
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公开(公告)号：US20220274347A1
公开(公告)日：2022-09-01
申请号：US17597912
申请日：2020-07-29
发明人： Rudolf Kaiser , Horst Lapsien
摘要： The invention relates to a bonding tool for a bonding device for bonding at least one component by adhesives to a substrate, the bonding device including a circular disc-shaped main body lying in a main plane and having an opening and a receiving head connected to the main body for receiving and holding the components, an orthogonal projection of the receiving head onto the main plane lying within the opening so that the receiving head is freely accessible through the opening. The bonding tool has a lighting unit integrated in the bonding tool for curing the adhesive. The invention also relates to a bonding device for bonding at least one component by adhesives applied to a substrate located in an assembly position, and to a bonding method for bonding components by adhesives applied to a substrate.
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