The invention relates to a bonding tool for a bonding device for bonding at least one component by adhesives to a substrate, the bonding device including a circular disc-shaped main body lying in a main plane and having an opening and a receiving head connected to the main body for receiving and holding the components, an orthogonal projection of the receiving head onto the main plane lying within the opening so that the receiving head is freely accessible through the opening. The bonding tool has a lighting unit integrated in the bonding tool for curing the adhesive. The invention also relates to a bonding device for bonding at least one component by adhesives applied to a substrate located in an assembly position, and to a bonding method for bonding components by adhesives applied to a substrate.