Thermally conductive insert element for electronic unit

    公开(公告)号:US11076503B2

    公开(公告)日:2021-07-27

    申请号:US16747097

    申请日:2020-01-20

    摘要: Electronic unit comprises an housing comprising a top cover; a printed circuit board mounted inside the housing and comprising at least a first heating source element on the top layer of the printed circuit board; the top cover comprises at least a first opening; the electronic unit comprises at least a first thermally conductive insert element distinct from the housing and extending from its top extremity arranged around the first opening, to its bottom extremity in thermal contact with the first heating source element such that heating dissipation of the first heating source element is allowed; fixing means configured to entirely fix the top extremity of the first thermally conductive insert element with the top cover around the first opening.

    HEAT TRANSFER DEVICE
    2.
    发明申请

    公开(公告)号:US20190285372A1

    公开(公告)日:2019-09-19

    申请号:US16288703

    申请日:2019-02-28

    摘要: The present invention relates to a heat transfer device, the heat transfer device includes a first plate like structure, and a second plate like structure, with the second plate like structure projecting from the first plate like structure, wherein both the second plate like structure and the first plate like structure each comprise one or more layers of graphite.

    Heat transfer device
    3.
    发明授权

    公开(公告)号:US11268772B2

    公开(公告)日:2022-03-08

    申请号:US16288703

    申请日:2019-02-28

    摘要: The present invention relates to a heat transfer device, the heat transfer device includes a first plate like structure, and a second plate like structure, with the second plate like structure projecting from the first plate like structure, wherein both the second plate like structure and the first plate like structure each comprise one or more layers of graphite.

    SYSTEM FOR COOLING AN ELECTRONIC DEVICE AND ASSEMBLY METHOD

    公开(公告)号:US20190230823A1

    公开(公告)日:2019-07-25

    申请号:US16244672

    申请日:2019-01-10

    IPC分类号: H05K7/20 H01L23/367

    摘要: An electronic device includes a rear end and a front end of a first group of fins respectively defining an air inlet and an air outlet of the first group, a rear end and a front end of a second group of fins respectively defining an air outlet and an air inlet of the second group, means adapted to generate a flow of air between the plurality of fins of the first group from the air inlet to the air outlet of the first group at least one air deflector arranged facing the air outlet of the first group and configured to orient the flow of air toward the air inlet of the second group so that the flow of air is able to flow between the fins of the second group from the air inlet to the air outlet of the second group.