公开(公告)号：US20200234991A1

公开(公告)日：2020-07-23

申请号：US16746285

申请日：2020-01-17

Applicant: APPLIED MATERIALS, INC.

Inventor： FRED ERIC RUHLAND ,  SUMIT S. PATANKAR ,  VIJAY D. PARKHE ,  DANIEL LEE DIEHL ,  MINGWEI ZHU ,  HIROYUKI TAKAHAMA ,  RANDY D. SCHMIEDING

IPC: H01L21/677

Abstract: Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.