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公开(公告)号:US11361982B2
公开(公告)日:2022-06-14
申请号:US16708908
申请日:2019-12-10
Applicant: APPLIED MATERIALS, INC.
Inventor: Kirankumar Neelasandra Savandaiah , William R. Johanson , David Gunther , Prashant Prabhakar Prabhu
IPC: H01L21/68 , H01L21/683 , B08B3/12 , H01L21/67
Abstract: Methods and apparatus for cleaning an electrostatic chuck (ESC) in a semiconductor chamber allow in-situ cleaning of the ESC. An apparatus may include an adapter or cover ring that is electrically isolated from a deposition ring; an annular grounding bracket mounted to and surrounding a pedestal, the annular grounding bracket has at least one horizontal grounding loop on an upper perimeter surface configured to provide electrical contact with the adapter or cover ring and to provide an RF return path to the ESC during plasma generation; and a bracket with a horizontal grounding loop on a first end to make electrical contact with the deposition ring and a vertical grounding loop on a second end to make electrical contact with a lift hoop which is electrically grounded, the bracket is mounted to, but electrically isolated from, the annular grounding bracket.
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公开(公告)号:USD851613S1
公开(公告)日:2019-06-18
申请号:US29621221
申请日:2017-10-05
Applicant: APPLIED MATERIALS, INC.
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公开(公告)号:USD877101S1
公开(公告)日:2020-03-03
申请号:US29639953
申请日:2018-03-09
Applicant: APPLIED MATERIALS, INC.
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公开(公告)号:USD894137S1
公开(公告)日:2020-08-25
申请号:US29690617
申请日:2019-05-09
Applicant: APPLIED MATERIALS, INC.
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