公开(公告)号：US20230185268A1

公开(公告)日：2023-06-15

申请号：US17548334

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Umesh Madhav Kelkar ,  Elizabeth Neville ,  Orlando Trejo ,  Sergey Meirovich ,  Kartik B. Shah ,  Shreyas Suresh Kher

IPC: G05B19/18 ,  G05B19/406

CPC classification number: G05B19/188 ,  G05B19/406 ,  G05B2219/32128 ,  G05B2219/45031

Abstract: Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).

公开(公告)号：US12228905B2

公开(公告)日：2025-02-18

申请号：US17548334

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Umesh Madhav Kelkar ,  Elizabeth Neville ,  Orlando Trejo ,  Sergey Meirovich ,  Kartik B. Shah ,  Shreyas Suresh Kher

IPC: G05B19/18 ,  G05B19/406

Abstract: Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).

公开(公告)号：US20220413452A1

公开(公告)日：2022-12-29

申请号：US17360652

申请日：2021-06-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik B. Shah ,  Satish Radhakrishnan ,  Karthik Ramanathan ,  Karthikeyan Balaraman ,  Adolph Miller Allen ,  Xinyuan Chong ,  Mitrabhanu Sahu ,  Wenjing Xu ,  Michael Sterling Jackson ,  Weize Hu ,  Feng Chen

IPC: G05B13/02 ,  G05B13/04

Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings. The first training data and the second training data are provided to train the machine learning model to predict which process recipe settings for the substrate temperature control process to be performed for the current substrate correspond to a target scratch profile for one or more surfaces of the current substrate.

公开(公告)号：US20230121513A1

公开(公告)日：2023-04-20

申请号：US18068469

申请日：2022-12-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik B. Shah ,  Satish Radhakrishnan ,  Karthik Ramanathan ,  Karthikeyan Balaraman ,  Adolph Miller Allen ,  Xinyuan Chong ,  Mitrabhanu Sahu ,  Wenjing Xu ,  Michael Sterling Jackson ,  Weize Hu ,  Feng Chen

IPC: G05B13/02 ,  G05B13/04

Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.

公开(公告)号：US09111980B2

公开(公告)日：2015-08-18

申请号：US13721311

申请日：2012-12-20

Applicant: APPLIED MATERIALS, INC.

Inventor： David K. Carlson ,  Michael R. Rice ,  Kartik B. Shah ,  Kashif Maqsood ,  Pravin K. Narwankar

IPC: C23C16/00 ,  H01L21/683 ,  B05B1/00 ,  C30B25/14 ,  C30B25/08 ,  E05F1/00 ,  H01L21/67 ,  H01L21/677 ,  C30B29/06

CPC classification number: H01L21/683 ,  B05B1/005 ,  C30B25/08 ,  C30B25/14 ,  C30B29/06 ,  E05F1/00 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/67173 ,  H01L21/67712 ,  H01L21/6776

Abstract: Apparatus for the removal of exhaust gases are provided herein. In some embodiments, an apparatus may include a carrier for supporting one or more substrates in a substrate processing tool, the carrier having a first exhaust outlet, and an exhaust assembly including a first inlet disposed proximate the carrier to receive process exhaust from the first exhaust outlet of the carrier, a second inlet to receive a cleaning gas, and an outlet to remove the process exhaust and the cleaning gas.

Abstract translation: 本文提供了用于排出废气的设备。 在一些实施例中，设备可以包括用于在衬底处理工具中支撑一个或多个衬底的载体，所述载体具有第一排气出口和排气组件，所述排气组件包括靠近所述载体设置的第一入口，以接收来自所述第一排气 载体的出口，用于接收清洁气体的第二入口和用于去除工艺废气和清洁气体的出口。