公开(公告)号：US20160243580A1

公开(公告)日：2016-08-25

申请号：US15147874

申请日：2016-05-05

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH M. RANISH ,  KAILASH PATALAY

IPC: B05C13/00 ,  C30B35/00 ,  C30B23/02

CPC classification number: B05C13/00 ,  C30B23/02 ,  C30B35/00 ,  H01L21/67115 ,  H01L21/68735

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.

公开(公告)号：US20170259294A1

公开(公告)日：2017-09-14

申请号：US15604900

申请日：2017-05-25

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH M. RANISH ,  KAILASH PATALAY

IPC: B05C13/00 ,  H01L21/687 ,  C30B23/02 ,  H01L21/67 ,  C30B35/00

CPC classification number: B05C13/00 ,  C30B23/02 ,  C30B35/00 ,  H01L21/67115 ,  H01L21/68735

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.

公开(公告)号：US20130256962A1

公开(公告)日：2013-10-03

申请号：US13788573

申请日：2013-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH M. RANISH ,  KAILASH PATALAY

IPC: B05C13/00

CPC classification number: B05C13/00 ,  C30B23/02 ,  C30B35/00 ,  H01L21/67115 ,  H01L21/68735

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.

Abstract translation: 本文提供了处理衬底的方法和装置。 在一些实施例中，一种装置包括处理套件，该处理套件包括第一环以支撑靠近衬底的周边边缘的衬底; 设置在所述第一环周围的第二环; 以及形成在所述第一和第二环之间的路径，其允许所述第一环相对于所述第二环旋转，其中所述路径基本上防止光在设置在所述第一和第二环下方的第一容积和设置在所述第二环之上的第二体积 第一和第二个戒指。