公开(公告)号：US20160133782A1

公开(公告)日：2016-05-12

申请号：US14538769

申请日：2014-11-11

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  KARTHIK ELUMALAI ,  JEN SERN LEW ,  MINGWEI ZHU

IPC: H01L33/00 ,  C23C16/458

CPC classification number: C23C16/4586 ,  C23C16/303 ,  H01L21/6831 ,  H01L21/68771

Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.

Abstract translation: 本文提供了改进的衬底载体的实施例。 在一些实施例中，衬底载体包括：多层盘，其具有由连续材料形成的上层和下层以及设置在其间的静电电极结构，其中所述多层盘的尺寸和布置为具有标称尺寸 其超过了用于制造发光二极管器件的标准衬底尺寸的标称尺寸，并且其中所述多层盘围绕中心轴对称地形成并且限定了基本平坦的上表面。

公开(公告)号：US20160151808A1

公开(公告)日：2016-06-02

申请号：US14556085

申请日：2014-11-28

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  JEN SERN LEW ,  ARVIND SUNDARRAJAN ,  SRINIVAS D. NEMANI

IPC: B08B5/02 ,  B08B6/00

CPC classification number: B08B5/02 ,  B08B6/00 ,  H01L21/67028 ,  H01L21/6831 ,  H01L21/6838

Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.

Abstract translation: 本文提供了用于从衬底的表面（例如从衬底的背面）去除颗粒的方法和设备的实施例。 在一些实施例中，用于从衬底的表面去除颗粒的设备包括：衬底处理器，用于暴露衬底的表面; 颗粒分离器，用于从基板的暴露表面分离颗粒; 用于输送分离的颗粒的颗粒转运体; 和用于收集被输送的颗粒的颗粒收集器。

公开(公告)号：US20180257116A1

公开(公告)日：2018-09-13

申请号：US15974000

申请日：2018-05-08

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  JEN SERN LEW ,  ARVIND SUNDARRAJAN ,  SRINIVAS NEMANI

IPC: B08B5/02 ,  H01L21/67 ,  H01L21/683 ,  B08B6/00

CPC classification number: B08B5/02 ,  B08B6/00 ,  H01L21/67028 ,  H01L21/6831 ,  H01L21/6838

Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.

公开(公告)号：US20170103908A1

公开(公告)日：2017-04-13

申请号：US15291762

申请日：2016-10-12

Applicant: APPLIED MATERIALS, INC.

Inventor： JEN SERN LEW ,  SRISKANTHARAJAH THIRUNAVUKARASU

IPC: H01L21/673 ,  H01L21/683

CPC classification number: H01L21/67346 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68757

Abstract: Embodiments of substrate carriers which enable active/passive bonding and de-bonding of a substrate are provided herein. In some embodiments, a substrate carrier for holding a substrate comprises a disk formed of a porous material, the disk being formed symmetrically about a central axis and defining a substantially planar upper surface. In some embodiments, the porous material is silicon carbide and the substrate carrier includes a semi-porous surface coating formed atop the upper surface of the disk.

公开(公告)号：US20180112310A1

公开(公告)日：2018-04-26

申请号：US15827845

申请日：2017-11-30

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  KARTHIK ELUMALAI ,  JEN SERN LEW ,  MINGWEI ZHU

IPC: C23C16/458 ,  H01L21/687 ,  H01L21/683 ,  C23C16/30

CPC classification number: C23C16/4586 ,  C23C16/303 ,  H01L21/6831 ,  H01L21/68771

Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.

公开(公告)号：US20160236245A1

公开(公告)日：2016-08-18

申请号：US14620781

申请日：2015-02-12

Applicant: APPLIED MATERIALS, INC.

Inventor： JEN SERN LEW ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  Mukund SUNDARARAJAN

IPC: B08B6/00 ,  H01L21/687 ,  H01L21/02 ,  H01L21/683

CPC classification number: H01L21/6831 ,  H01L21/0209 ,  H01L21/68785

Abstract: An apparatus for removing particles from a substrate contact surface includes parallel electrodes disposed beneath the substrate contact surface; and an alternating current (AC) power supply having a first AC terminal connected to a first parallel electrode and a second AC terminal connected to a second parallel electrode adjacent to the first parallel electrode, wherein an AC output of the first AC terminal has a different phase than an AC output of the second AC terminal. A method of removing particles from a substrate contact surface includes supplying a first alternating current (AC) to a first one of parallel electrodes disposed beneath the substrate contact surface; and supplying a second alternating current to a second one of the parallel electrodes disposed adjacent to the first parallel electrode; wherein the first alternating current has a different phase than the second alternating current.

Abstract translation: 用于从基板接触表面去除颗粒的装置包括设置在基板接触表面下方的平行电极; 以及具有连接到第一并联电极的第一AC端子和与第一并联电极相邻的第二并联电极连接的第二AC端子的交流（AC）电源，其中第一AC端子的AC输出具有不同的 相位比第二AC端子的AC输出。 从衬底接触表面去除颗粒的方法包括向设置在衬底接触表面下方的平行电极中的第一个提供第一交流电流（AC）; 并向邻近所述第一平行电极设置的所述平行电极中的第二平行电极提供第二交流电; 其中所述第一交流电流具有与所述第二交流电流不同的相位。