公开(公告)号：US11609505B2

公开(公告)日：2023-03-21

申请号：US17222696

申请日：2021-04-05

Applicant: Applied Materials, Inc.

Inventor： Mangesh Ashok Bangar ,  Gautam Pisharody ,  Lancelot Huang ,  Alan L. Tso ,  Douglas A. Buchberger, Jr. ,  Huixiong Dai ,  Dmitry Lubomirsky ,  Srinivas D. Nemani ,  Christopher Siu Wing Ngai

IPC: G03F7/20 ,  G01N27/10

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for verification and re-use of process fluids. The apparatus generally includes a tool for performing lithography, and a recirculation path coupled to the tool. The recirculation path generally includes a collection unit coupled at first end to a first end of the tool, and a probe coupled at a first end to a second end of the collection unit, the probe for determining one or more characteristics of a fluid flowing from the tool. The recirculation path of the apparatus further generally includes a purification unit coupled at a first end to a third end of the collection unit, the purification unit further coupled at a second end to a second end of the probe, the purification unit for changing a characteristic of the fluid.

公开(公告)号：US20180122679A1

公开(公告)日：2018-05-03

申请号：US15337973

申请日：2016-10-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Shambhu N. Roy ,  Gautam Pisharody ,  Seshadri Ramaswami ,  Srinivas D. Nemani ,  Zhong Qiang Hua ,  Douglas A. Buchberger, JR. ,  Niranjan Kumar ,  Ellie Y. Yieh

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2021/6006 ,  H01L2221/68304

Abstract: A substrate carrier with contacts is described that is balanced for thermal stress. In one example workpiece carrier has a rigid substrate configured to support a workpiece to be carried for processing, a first dielectric layer over the substrate, an electrostatic conductive electrode over the first dielectric layer to electrostatically hold the workpiece to be carried, a second dielectric layer over the electrode to electrically isolate the workpiece from the electrode, and a third dielectric layer under the substrate to counter thermal stress applied to the substrate by the first and second dielectric layers.

公开(公告)号：US20180025931A1

公开(公告)日：2018-01-25

申请号：US15217328

申请日：2016-07-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas D. Nemani ,  Shambhu N. Roy ,  Gautam Pisharody ,  Douglas A. Buchberger, JR. ,  Ellie Y. Yieh ,  Zhong Qiang Hua

IPC: H01L21/683 ,  C23C16/513

CPC classification number: H01L21/6833 ,  C23C16/4581 ,  C23C16/4586 ,  C23C16/513

Abstract: A processed wafer is described that may be used as a workpiece carrier in semiconductor and mechanical processing. In some examples, the workpiece carrier includes a substrate, an electrode formed on the substrate to carry an electric charge to grip a workpiece, a through hole through the substrate and connected to the electrode, and a dielectric layer over the substrate to isolate the electrode from the workpiece.

公开(公告)号：US12112972B2

公开(公告)日：2024-10-08

申请号：US17221215

申请日：2021-04-02

Applicant: Applied Materials, Inc.

Inventor： Qiwei Liang ,  Douglas Arthur Buchberger, Jr. ,  Gautam Pisharody ,  Dmitry Lubomirsky ,  Shekhar Athani

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/505 ,  H01J37/32 ,  H01L21/683

CPC classification number: H01L21/68785 ,  C23C16/4584 ,  C23C16/4586 ,  C23C16/463 ,  C23C16/505 ,  H01J37/32091 ,  H01J37/32724 ,  H01J37/32899 ,  H01L21/6833 ,  H01L21/68792 ,  C23C16/45565 ,  H01J37/32183 ,  H01J37/32568 ,  H01J37/32642 ,  H01J37/32706

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a chemical vapor deposition (CVD) chamber includes: a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body; a rotary union coupled to the pedestal, wherein the rotary union includes a stationary housing disposed about a rotor; a drive assembly coupled to the rotary union; a coolant union coupled to the rotary union and having a coolant inlet fluidly coupled to coolant channels disposed in the pedestal via a coolant line; an RF rotary joint coupled to the coolant union and having an RF connector configured to couple the pedestal to an RF bias power source; and an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body to provide RF bias to the pedestal.

公开(公告)号：US11555730B2

公开(公告)日：2023-01-17

申请号：US17067344

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Douglas A. Buchberger, Jr. ,  Gautam Pisharody ,  Lancelot Huang

IPC: G01F23/24 ,  G01F25/10

Abstract: A method and apparatus for determining particle contamination of a process fluid is disclosed herein. In one example, a fluid resistivity measurement probe is provided. The system includes an upstream fluid conduit, a downstream fluid conduit, and a measuring section. The measuring section has a metal rod, and a ground electrode. The ground electrode surrounds and is coaxial with the metal rod. The upstream fluid conduit is coupled to a first end of the ground electrode. The downstream fluid conduit is coupled to a second end of the ground electrode. The metal rod and the ground electrode define a space therebetween. The space flows a fluid from the upstream fluid conduit to the downstream fluid conduit.

公开(公告)号：US20180144959A1

公开(公告)日：2018-05-24

申请号：US15360412

申请日：2016-11-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas D. Nemani ,  Gautam Pisharody ,  Seshadri Ramaswami ,  Shambhu N. Roy ,  Niranjan Kumar

IPC: H01L21/67 ,  H01L21/683 ,  G01R29/12

CPC classification number: H01L21/67288 ,  G01R29/12 ,  H01L21/67253 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6838

Abstract: An electrostatic chucking force tool is described that may be used on workpiece carriers for micromechanical and semiconductor processing. One example includes a workpiece fitting to hold a workpiece when gripped by an electrostatic chucking force by an electrostatic chuck, an arm coupled to the workpiece fitting to pull the workpiece through the workpiece fitting laterally across the chuck, and a force gauge coupled to the arm to measure an amount of force with which the workpiece fitting is pulled by the arm in order to move the workpiece.