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公开(公告)号:US11874189B2
公开(公告)日:2024-01-16
申请号:US17367250
申请日:2021-07-02
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin , David Peterson , Philip Allan Kraus , Amir Bayati
CPC classification number: G01L19/0092 , H03H9/02015 , H03H9/02574 , H03H9/14502 , G01N29/022 , G01N2291/014
Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.
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公开(公告)号:US20230003598A1
公开(公告)日:2023-01-05
申请号:US17367250
申请日:2021-07-02
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin , David Peterson , Philip Allan Kraus , Amir Bayati
Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.
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公开(公告)号:US11346875B2
公开(公告)日:2022-05-31
申请号:US16283364
申请日:2019-02-22
Applicant: APPLIED MATERIALS, INC.
Inventor: Chuang-Chia Lin , Upendra Ummethala
Abstract: Embodiments include systems and methods for determining a processing parameter of a processing operation. Embodiments include a diagnostic substrate for determining processing parameters of a processing operation. In an embodiment, the diagnostic substrate comprises a substrate, a circuit layer over the substrate, and a capping layer over the circuit layer. In an embodiment, a micro resonator sensor is in the circuit layer and the capping layer. In an embodiment, the micro resonator sensor comprises, a resonating body and one or more electrodes for inducing resonance in the resonating body.
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公开(公告)号:US20220116013A1
公开(公告)日:2022-04-14
申请号:US17068725
申请日:2020-10-12
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin
IPC: H03H9/02 , H01L41/113
Abstract: A sensor device that includes an integrated sensor assembly having a surface acoustic wave (SAW) sensor disposed on a piezoelectric substrate. The SAW sensor is adapted to measure an environmental condition of an environment in response to an RF signal. The SAW sensor includes an interdigitated transducer (IDT) formed on a substrate having at least a layer of a piezoelectric material. The SAW sensor includes either one or more SAW reflectors of a second IDT formed on the piezoelectric material. The SAW sensor further includes an RF antenna formed on the piezoelectric material. The SAW sensor and the RF antenna are integrated with one another on the piezoelectric material.
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公开(公告)号:US20190265287A1
公开(公告)日:2019-08-29
申请号:US16283369
申请日:2019-02-22
Applicant: APPLIED MATERIALS, INC.
Inventor: Chuang-Chia Lin , Upendra Ummethala
Abstract: Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.
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公开(公告)号:US20220172968A1
公开(公告)日:2022-06-02
申请号:US17109019
申请日:2020-12-01
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin , Wenwei Qiao
IPC: H01L21/67 , H01J37/32 , C23C16/52 , G01L15/00 , G01F15/06 , G01F15/14 , G01L19/14 , G01N25/18 , G01L19/08
Abstract: A sensor assembly that includes a substrate and a set of sensors. The set of sensor includes pressure sensor and/or flow sensors located across a surface of the substrate. Each respective sensor of the plurality of sensor is adapted to measure a respective pressure or a respective flow of an environment proximate the respective sensor. Each respective sensor of the plurality of sensor may further be adapted to output a respective signal associated with the measured respective pressure or the measured respective flow. The respective signals associated with the measured respective pressure or the measured respective flows measured by the plurality of sensor together provide a pressure distribution across the surface of the substrate and/or a flow distribution across the surface of the substrate.
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公开(公告)号:US11009538B2
公开(公告)日:2021-05-18
申请号:US16283371
申请日:2019-02-22
Applicant: APPLIED MATERIALS, INC.
Inventor: Chuang-Chia Lin , Upendra Ummethala , Andrew Choe
Abstract: Embodiments include systems and methods for determining a processing parameter of a processing operation utilizing micro resonator sensors. Some embodiments include a diagnostic substrate comprising a substrate, a circuit layer over the substrate, a cavity in the circuit layer, a capping layer over the circuit layer, a resonating body in or over the cavity, one or more electrodes in the cavity, and circuitry for driving and sensing the resonant frequency of the resonating body. In an embodiment, the circuitry comprises a biasing circuitry block configured to provide a bias voltage to the one or more electrodes, a frequency generator circuitry block configured to provide a signal with a varying frequency to the one or more electrodes, and a sensing circuitry block configured to detect a value correlated to oscillation of the resonating body.
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公开(公告)号:US20250069868A1
公开(公告)日:2025-02-27
申请号:US18948311
申请日:2024-11-14
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin , Wenwei Qiao
Abstract: Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.
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公开(公告)号:US20240290640A1
公开(公告)日:2024-08-29
申请号:US18659343
申请日:2024-05-09
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin , Wenwei Qiao
IPC: H01L21/67 , C23C16/52 , G01F15/063 , G01F15/14 , G01L15/00 , G01L19/08 , G01L19/14 , G01N25/18 , H01J37/32
CPC classification number: H01L21/67253 , C23C16/52 , G01F15/063 , G01F15/14 , G01L15/00 , G01L19/086 , G01L19/14 , G01N25/18 , H01J37/32715 , H01J37/32935 , H01J37/32082 , H01J2237/2007 , H01J2237/3343 , H01L21/67069
Abstract: A sensor system includes a processing chamber and a sensor assembly disposed within the processing chamber. The sensor assembly includes a substrate and a plurality of sensors including at least one of pressure sensors or flow sensors disposed across a surface of the substrate. Each respective sensor is adapted to measure a respective pressure or a respective flow of an environment proximate the respective sensor. The sensor system further includes a processing device communicatively coupled to the sensor assembly. The processing device is adapted to receive at least one of the measured respective pressures or the measured respective flows and determine a pressure distribution or a flow distribution of the processing chamber.
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10.
公开(公告)号:US20240112885A1
公开(公告)日:2024-04-04
申请号:US18220020
申请日:2023-07-10
Applicant: Applied Materials, Inc.
Inventor: Chuang-Chia Lin
IPC: H01J37/32
CPC classification number: H01J37/3211 , H01J37/32091 , H01J37/32926
Abstract: Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate and a sensor on the substrate. In an embodiment, the diagnostic substrate further comprises a communication module on the substrate that is communicatively coupled to the sensor. In an embodiment, the communication module comprises an output antenna, a switch coupled to the output antenna, and a signal source coupled to the switch.
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