公开(公告)号：US10312065B2

公开(公告)日：2019-06-04

申请号：US15290150

申请日：2016-10-11

申请人： APPLIED MATERIALS, INC.

发明人： Martin Lee Riker ,  Keith A. Miller ,  Shreekant Gayaka ,  Carl R. Johnson

IPC分类号： H01J37/34 ,  C23C14/35 ,  C23C14/54 ,  H01J37/32 ,  H01L21/285 ,  H01L21/3065 ,  H01L21/66

摘要： A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.

公开(公告)号：US11049701B2

公开(公告)日：2021-06-29

申请号：US15823176

申请日：2017-11-27

申请人： APPLIED MATERIALS, INC.

发明人： Adolph Miller Allen ,  William Johanson ,  Viachslav Babayan ,  Zhong Qiang Hua ,  Carl R. Johnson ,  Vanessa Faune ,  Jingjing Liu ,  Vaibhav Soni ,  Kirankumar Savandaiah ,  Sundarapandian Ramalinga Vijayalaks Reddy

IPC分类号： H01J37/34 ,  H01J37/32 ,  C23C14/34 ,  C23C16/458 ,  H01J37/02

摘要： Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.