公开(公告)号：US20190081387A1

公开(公告)日：2019-03-14

申请号：US15874805

申请日：2018-01-18

Applicant: Apple Inc.

Inventor： Sameer PANDYA ,  Mario MARTINIS ,  Baris OZGEN ,  Tyler S. BUSHNELL ,  Sherry TANG ,  Henry H. YANG ,  Christopher M. WERNER ,  Jayesh NATH ,  Carlo DI NALLO ,  Andrea RUARO

IPC: H01Q1/24 ,  H04M1/02 ,  H04L29/06

Abstract: Aspects of the subject technology relate to electronic devices with antennas. The antenna may be a display-integrated antenna. An antenna feed for the antenna may be located in a recess in a sidewall of a housing of the device. The antenna feed may be coupled to transceiver circuitry on a logic board of the device by a pair of flex circuits. A first one of the pair of flex circuits may form a portion of an antenna feed assembly. A second one of the pair of flex circuits may be an impedance-matching flex having an end that is soldered to the main logic board. The antenna may be coupled to a conductive portion of the housing of the device.

公开(公告)号：US20140218841A1

公开(公告)日：2014-08-07

申请号：US13872000

申请日：2013-04-26

Applicant: APPLE INC.

Inventor： Gang NING ,  Shawn Xavier ARNOLD ,  Jeffrey M. THOMA ,  Henry H. YANG

IPC: H01G4/35

CPC classification number: H01G4/35 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract translation: 所描述的实施例通常涉及用于安装在印刷电路板（PCB）上的电容器组件，更具体地涉及用于将电容器组件与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 电容器组件中的终端元件，包括电容器组件中的多孔导电层可以减少从电容器传递到PCB的振动能量。 包括软接触层的端接元件也可以减少传递到PCB的振动能量。 此外，具有增厚的介电材料的电容器组件可以减少传递到PCB的振动能量。

公开(公告)号：US20170089698A1

公开(公告)日：2017-03-30

申请号：US15263316

申请日：2016-09-12

Applicant: Apple Inc.

Inventor： Rex T. EHMAN ,  William C. LUKENS ,  David M. PELLETIER ,  Henry H. YANG

IPC: G01C5/06 ,  G01L19/14

CPC classification number: G01C5/06 ,  G01L9/0041 ,  G01L19/0038 ,  G01L19/14

Abstract: An electronic device having a pressure sensor configured to determine pressure is disclosed. The electronic device includes an enclosure defining an internal volume. The enclosure may include a sidewall with an external opening that provides a vent for the internal components. To reduce the response of the pressure sensor (that is, the time required to detect a pressure change), the pressure sensor may secure with an internal wall of the enclosure. Further, the internal wall includes an opening defining an air pocket significantly smaller than the internal volume. When the pressure sensor is mounted to receive air via the air pocket, the pressure sensor may respond faster to pressure changes, as compared to receiving air circulating throughout the internal volume. This is due in part to an amount of airflow passing through the air pocket causing a greater pressure change throughout the air pocket as compared to the internal volume.