-
公开(公告)号：US11844178B2
公开(公告)日：2023-12-12
申请号：US17325080
申请日：2021-05-19
Inventor： John David Brazzle , Sok Mun Chew
CPC classification number: H05K1/181 , H01F27/29 , H01L23/3121 , H01L25/167 , H05K3/3447 , H01L23/49575 , H05K2201/1003 , H05K2201/10515 , H05K2201/10901
Abstract: An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.
-
公开(公告)号：US11083089B1
公开(公告)日：2021-08-03
申请号：US16815536
申请日：2020-03-11
Inventor： Teik Tiong Toong , Sok Mun Chew , Chern Beng Kang
Abstract: A package is disclosed. The package includes a substrate and an electrical component vertically mounted to the substrate. The electrical component has a first end, a second end vertically spaced from the first end, and a side wall extending from the first end to the second end. The first end of the electrical component is positioned between the substrate and the second end of the electrical component. The package can also include a molding material disposed at least partially along the side wall of the electrical component.
-
公开(公告)号：US20210378098A1
公开(公告)日：2021-12-02
申请号：US17325080
申请日：2021-05-19
Inventor： John Brazzle , Sok Mun Chew
Abstract: An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.
-
-
Search Results
3
records
(took 0.012 seconds)
