公开(公告)号：US20240224464A1

公开(公告)日：2024-07-04

申请号：US18147672

申请日：2022-12-28

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： YI-HSIN HUANG ,  CHUN-LUNG WU ,  KUO-WEI LEE ,  TZE-YANG YEH

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20409

Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

公开(公告)号：US20230230897A1

公开(公告)日：2023-07-20

申请号：US17577243

申请日：2022-01-17

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： YI-HSIN HUANG ,  CHING-MING YANG ,  TZE-YANG YEH

IPC: H01L23/373

CPC classification number: H01L23/3736 ,  H01L2224/8384

Abstract: A surface modification and joint method for an automobile heat dissipation device and an automobile heat dissipation device having a modified surface are provided. The surface modification and joint method includes providing a metal heat dissipation device, forming a sputtered metal layer that is patterned on a surface of the metal heat dissipation device by sputtering to form a modification area of the metal heat dissipation device so as to modify the surface of the metal heat dissipation device, and jointing a surface of the sputtered metal layer to at least one automobile electronic module by sintering, so that the metal heat dissipation device is thermally coupled to the at least one automobile electronic module.