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公开(公告)号：US20240344783A1
公开(公告)日：2024-10-17
申请号：US18299719
申请日：2023-04-13
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHING-MING YANG , KUN-LIN CHIH , YI-SHENG LU , TZE-YANG YEH
IPC: F28F13/18
CPC classification number: F28F13/18 , C23C28/021 , F28F3/022
Abstract: A cooling structure having a metal plating layer is provided with a substrate, a first metal plating layer and a second metal plating layer that are made of materials different from each other and formed on the substrate by different processes. The first metal plating layer is formed on the substrate by a wetting process. The second metal plating layer having a thickness ranging from 0.1 μm to 5 μm is formed on the first metal plating layer by a sputtering process. The second metal plating layer includes at least three blocks arranged at intervals, and at least two adjacent ones of the at least three blocks have a distance therebetween that is not equal to a distance between another two adjacent ones of the at least three blocks.
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公开(公告)号：US20240295371A1
公开(公告)日：2024-09-05
申请号：US18646715
申请日：2024-04-25
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： KUO-WEI LEE , CHING-MING YANG , CHI-AN CHEN , TZE-YANG YEH
CPC classification number: F28F13/187 , H05K7/20236 , H05K7/20263
Abstract: An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 μm. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 μm and 200 μm, and a depth of each of the plurality of micropores is between 100 nm and 50 μm.
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公开(公告)号：US20240244793A1
公开(公告)日：2024-07-18
申请号：US18097665
申请日：2023-01-17
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHUN-TE WU , CHING-MING YANG , YU-WEI CHIU , TZE-YANG YEH
IPC: H05K7/20
CPC classification number: H05K7/2039 , H05K7/203
Abstract: A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.
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公开(公告)号：US20240155808A1
公开(公告)日：2024-05-09
申请号：US17981182
申请日：2022-11-04
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHUN-TE WU , CHING-MING YANG , YU-WEI CHIU , TZE-YANG YEH
IPC: H05K7/20
CPC classification number: H05K7/2039 , H05K7/203
Abstract: A two-phase immersion-cooling heat-dissipation composite structure is provided. The heat-dissipation composite structure includes a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosity solid structure. The heat dissipation base has a first surface and a second surface that face away from each other. The second surface of the heat dissipation base is in contact with a heating element immersed in a two-phase coolant. The first surface of the heat dissipation base is connected to the high-thermal-conductivity fins. The at least one high-porosity solid structure is located at the first surface of the heat dissipation base, and is connected and alternately arranged between side walls of two adjacent ones of the high-thermal-conductivity fins. Each of the high-porosity solid structure includes a plurality of closed holes and a plurality of open holes.
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5.发明公开公开(公告)号：US20240060729A1
公开(公告)日：2024-02-22
申请号：US17890317
申请日：2022-08-18
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHING-MING YANG , CHUN-LUNG WU , TZE-YANG YEH
CPC classification number: F28F3/022 , F28F13/06 , F28F3/04 , F28F2215/04
Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.
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Patent Agency Ranking
公开(公告)号：US20230184498A1
公开(公告)日：2023-06-15
申请号：US17549871
申请日：2021-12-14
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHENG-SHU PENG , TZE-YANG YEH
IPC: F28F13/00
CPC classification number: F28F13/003
Abstract: An immersion-type heat dissipation substrate having a microporous structure is provided. The immersion-type heat dissipation substrate includes a surface having a plurality of micropores for facilitating generation of vapor bubbles. A pore diameter of each of the plurality of micropores is between 5 μm and 150 μm, and the plurality of micropores cover 3% to 40% of an area of the surface.
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公开(公告)号：US20230180435A1
公开(公告)日：2023-06-08
申请号：US17545054
申请日：2021-12-08
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHING-MING YANG , CHENG-SHU PENG , TZE-YANG YEH
CPC classification number: H05K7/203 , H05K7/20436 , B23P15/26
Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation material in a form of a sheet. A surface of the porous heat dissipation material has a plurality of open pores that are configured to generate air bubbles. A 1 mm2 cross-sectional area of the surface of the porous heat dissipation has at least five of the open pores each having a depth greater than 25 μm.
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公开(公告)号：US20230098773A1
公开(公告)日：2023-03-30
申请号：US17489942
申请日：2021-09-30
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHENG-SHU PENG , TZE-YANG YEH , CHIH-HUNG SHIH
Abstract: An immersion-type porous heat dissipation substrate structure is provided. The immersion-type porous heat dissipation substrate structure includes a porous heat dissipation base formed by sintering of metal powder. The porous heat dissipation base is immersed in a two-phase coolant for increasing an amount of bubbles that is generated, and has a porosity that is controlled to be between 5% and 50%. Or, the porous heat dissipation base has more than one porosity.
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公开(公告)号：US20230009424A1
公开(公告)日：2023-01-12
申请号：US17903993
申请日：2022-09-06
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： CHING-MING YANG , TZE-YANG YEH
Abstract: The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.
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公开(公告)号：US20240280332A1
公开(公告)日：2024-08-22
申请号：US18170676
申请日：2023-02-17
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： YU-WEI CHIU , CHING-MING YANG , CHUN-TE WU , TZE-YANG YEH
IPC: F28F3/02
CPC classification number: F28F3/02 , F28F2215/00
Abstract: A two-phase immersion-cooling heat-dissipation structure having skived fins with high surface roughness includes an immersion-cooling substrate and a plurality of skived fins. The immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface is used for contacting a heat source immersed in a two-phase coolant, the top surface is connected with the plurality of skived fins, a center line average roughness Ra of a surface of the plurality of skived fins is greater than 10 μm, and a ten point average roughness Rz of the surface of the plurality of skived fins is greater than 20 μm, such that a ratio between a surface area of the plurality of skived fins in contact with the two-phase coolant and a volume of the plurality of skived fins is greater than 400.
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