公开(公告)号：US09042404B2

公开(公告)日：2015-05-26

申请号：US13925284

申请日：2013-06-24

Applicant: ALTERA CORPORATION

Inventor： Keith Duwel ,  Michael Menghui Zheng ,  Vinson Chan ,  Kalyan Kankipati

IPC: H04J3/16 ,  H04J3/04 ,  H04L5/22 ,  H04J3/06

CPC classification number: H04J3/1682 ,  H04J3/04 ,  H04J3/0685 ,  H04L5/22 ,  H04Q2213/13208 ,  H04Q2213/13322

Abstract: The present application discloses apparatus and methods for increasing channel utilization for a high-speed serial interface of an integrated circuit (IC). A new circuit architecture is disclosed which provides circuitry that may be programmed flexibly to support a multitude of different channel bonding schemes. In accordance with one aspect of the invention, the new architecture decouples the granularity of control-signal channel bonding from the granularity of data-aggregation channel bonding. This advantageously allows optimization of configurations for both types of channel bonding. In another aspect of the invention, the logical boundaries of bonded user channels are decoupled from the physical boundaries of the PCS modules. This decoupling advantageously eliminates a rigid constraint of previous architectures.

Abstract translation: 本申请公开了用于增加集成电路（IC）的高速串行接口的信道利用的装置和方法。 公开了一种新的电路架构，其提供可以被灵活地编程以支持多种不同的信道绑定方案的电路。 根据本发明的一个方面，新架构使控制信号信道绑定的粒度与数据聚合信道绑定的粒度分离。 这有利地允许优化用于两种类型的通道结合的配置。 在本发明的另一方面，粘合用户信道的逻辑边界与PCS模块的物理边界分离。 这种去耦有利地消除了先前架构的刚性约束。