公开(公告)号：US20130298101A1

公开(公告)日：2013-11-07

申请号：US13874925

申请日：2013-05-01

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Rajit C. Chandra

IPC: G06F17/50

CPC classification number: G06F17/50 ,  G06F17/5018 ,  G06F17/5045 ,  H01L2224/16145 ,  H01L2224/16225

Abstract: A method and apparatus generates thermal partitions for metal interconnects of an integrated circuit, based on interconnect self heat data and mutual heat data. Each of the thermal partitions includes data identifying thermally related interconnects and respective temperature values associated with each of the thermally related interconnects. Thermally related partitions that can be computed efficiently and simultaneously and the results then integrated using superposition for the full chips.

Abstract translation: 一种方法和装置基于互连自热数据和互热数据产生集成电路的金属互连的热隔离。 每个热分区包括识别热相关互连的数据和与热相关互连中的每一个相关联的相应温度值。 可以有效和同时计算的热相关分区，然后使用叠加来获得完整芯片的结果。

公开(公告)号：US20140181780A1

公开(公告)日：2014-06-26

申请号：US13725121

申请日：2012-12-21

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Thomas D. Burd ,  Srinivasaraghavan Srini Krishnamoorthy ,  Vishak K. Venkatraman ,  Yuri Apanovich ,  James A. Pistole ,  Rajit C. Chandra

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F2217/76 ,  G06F2217/78 ,  G06F2217/80

Abstract: Methods and media for analyzing electrical designs are provided. A method includes and the media are configured for providing or loading to an analysis tool a design that includes a plurality of cell instances of a standard cell and estimating a failure rate of the design using in context electrical parameters for the plurality of cell instances and a parameterized electromigration (EM) view of the standard cell. Another method includes providing a standard cell of a standard cell library and characterizing the standard cell to create a parameterized thermal model to compute a temperature of an internal structure of the standard cell and a parameterized current model to compute a current through the internal structure of the standard cell given in context electrical parameters.

Abstract translation: 提供了分析电气设计的方法和介质。 方法包括并且介质被配置为向分析工具提供或加载包括标准单元的多个单元实例的设计，并且在多个单元实例的上下文电参数中估计设计的故障率，以及 标准电池的参数化电迁移（EM）视图。 另一种方法包括提供标准单元库的标准单元并表征标准单元以创建参数化热模型以计算标准单元的内部结构的温度和参数化的电流模型，以计算通过内部结构的电流 在上下文电参数中给出标准单元。

公开(公告)号：US09323870B2

公开(公告)日：2016-04-26

申请号：US13874925

申请日：2013-05-01

Applicant: Advanced Micro Devices, Inc.

Inventor： Rajit C. Chandra

IPC: G06F17/50

CPC classification number: G06F17/50 ,  G06F17/5018 ,  G06F17/5045 ,  H01L2224/16145 ,  H01L2224/16225

Abstract: A method and apparatus generates thermal partitions for metal interconnects of an integrated circuit, based on interconnect self heat data and mutual heat data. Each of the thermal partitions includes data identifying thermally related interconnects and respective temperature values associated with each of the thermally related interconnects. Thermally related partitions that can be computed efficiently and simultaneously and the results then integrated using superposition for the full chips.

Abstract translation: 一种方法和装置基于互连自热数据和互热数据产生集成电路的金属互连的热隔离。 每个热分区包括识别热相关互连的数据和与热相关互连中的每一个相关联的相应温度值。 可以有效和同时计算的热相关分区，然后使用叠加来获得完整芯片的结果。