-
公开(公告)号：US20240364082A1
公开(公告)日：2024-10-31
申请号：US18292062
申请日：2022-07-21
发明人： Heng WANG , Stefan ILLEK
CPC分类号： H01S5/3077 , H01L33/06 , H01L33/145 , H01L33/305 , H01S5/34326 , H01S5/3436
摘要： The invention relates to a radiation-emitting semiconductor body, having a first semiconductor region of a first doping type, which has a first material composition, a second semiconductor region of a second doping type, which has a second material composition, an active region, which is located between the first semiconductor region and the second semiconductor region, and a first intermediate region, which is located between the first semiconductor region and the active region, wherein the active region includes a plurality of quantum well layers and a plurality of barrier layers, which are arranged alternatingly one above the other, the barrier layers have a third material composition, the first intermediate region includes at least one first blocking layer and at least one first intermediate layer, and the first blocking layer has a fourth material composition and the first intermediate layer has a fifth material composition. The invention also relates to a laser diode and to a light-emitting diode.
-
2.发明公开公开(公告)号：US20240353541A1
公开(公告)日：2024-10-24
申请号：US18682121
申请日：2022-07-29
发明人： Jens EBBECKE
IPC分类号： G01S7/4865 , G01S17/10
CPC分类号： G01S7/4865 , G01S17/10
摘要： A measurement method includes emitting a transmission signal comprising at least one light pulse, wherein an amplitude of an intensity of the light pulse is modulated with a modulation frequency, detecting a receiving signal comprising at least a part of the transmission signal that is reflected from an external object, selecting at least one frequency component of the receiving signal corresponding to the modulation frequency of the transmission signal, and determining a distance to the external object from a time difference between the emission of the transmission signal and the detection of the selected frequency component of the receiving signal.
-
3.发明公开公开(公告)号：US20240347680A1
公开(公告)日：2024-10-17
申请号：US18579474
申请日：2022-07-21
CPC分类号： H01L33/54 , H01L33/005 , H01L33/483 , H01L33/56 , H01L2933/005
摘要： In an embodiment an arrangement includes an optoelectronic component having a radiation passage surface and a housing top surface, which surrounds the radiation passage surface in lateral directions at least in places and a cover covering the radiation passage surface and the housing top surface at least in places, wherein the cover is configured to be partially removed such that the radiation passage surface is at least partially exposed and the housing top surface remains covered at least in places by a remainder of the cover.
-
公开(公告)号：US20240347676A1
公开(公告)日：2024-10-17
申请号：US18576346
申请日：2022-07-11
发明人： Juergen Moosburger
CPC分类号： H01L33/405 , H01L33/38 , H01L2933/0016
摘要： In an embodiment a method for producing an optoelectronic component includes providing a semiconductor layer sequence, applying a matrix material comprising ferromagnetic particles, wherein the matrix material is heatable by inductive heating of the ferromagnetic particles, inductively heating the ferromagnetic particles thereby at least partly softening the matrix material and curing the matrix material, wherein the matrix material forms at least part of a carrier.
-
5.发明公开公开(公告)号：US20240332133A1
公开(公告)日：2024-10-03
申请号：US18576334
申请日：2022-07-26
发明人： Michael Zitzlsperger
IPC分类号： H01L23/495 , H01L23/00 , H01L25/065
CPC分类号： H01L23/49506 , H01L23/49548 , H01L23/49575 , H01L24/37 , H01L24/45 , H01L25/0652 , H01L2224/37005 , H01L2224/3702 , H01L2224/45005 , H01L2224/4502 , H01L2924/01029 , H01L2924/096 , H01L2924/181
摘要： In an embodiment a carrier includes a shaped body, a lead frame, a first electrode and a second electrode, wherein the first electrode includes a first subregion of the lead frame, a second subregion of the lead frame, and an electrical connection connecting the first subregion to the second subregion, wherein the first subregion is laterally spaced from the second subregion by an intermediate region, wherein the lead frame has at least one subsection, which is located at least in places in the intermediate region and thus in a lateral direction between the first subregion and the second subregion of the first electrode, wherein the intermediate region is at least partially filled by the shaped body or directly adjoins the shaped body, the electrical connection being embedded in the shaped body, and wherein the subsection of the lead frame is neither a subregion of the first electrode nor a subregion of the second electrode.
-
6.发明公开公开(公告)号：US20240313148A1
公开(公告)日：2024-09-19
申请号：US18576646
申请日：2022-07-07
发明人： Laura Kreiner , Jelena Ristic
CPC分类号： H01L33/007 , H01L33/0093 , H01L33/42
摘要： In an embodiment, a method for producing a radiation-emitting semiconductor chip includes providing a substrate, applying an intermediate layer to the substrate, applying a semiconducting layer sequence to the intermediate layer, applying an etch stop layer to the semiconducting layer sequence, epitaxially applying a semiconductor body having an inclined side surface to the etch stop layer and removing the substrate, the intermediate layer and the semiconducting layer sequence up to the etch stop layer.
-
公开(公告)号：US12078593B2
公开(公告)日：2024-09-03
申请号：US17919713
申请日：2021-04-21
发明人： Gerd Plechinger
IPC分类号： G01N21/359 , G01J3/10 , G01N21/55
CPC分类号： G01N21/359 , G01J3/10 , G01N21/55 , G01N2021/558 , G01N2201/123
摘要： A method for the time-differentiated detection of a spectrum of a test object comprises providing a first conversion dye, which is configured to convert light with a first spectral distribution in the visible range into light with a second spectral distribution in the infrared range. The first conversion dye is excited with a light pulse in the range of the first spectral distribution during a first time period, and a light fraction, reflected or transmitted by the test object, in the range of the first spectral distribution is registered during a first time interval. During a subsequent second time period, a fraction of converted light reflected or transmitted by the test object is registered. According to the invention, the first time interval is selected so that it lies substantially inside a luminescence lifetime for the first conversion dye in the first time period.
-
公开(公告)号：US20240292504A1
公开(公告)日：2024-08-29
申请号：US18570378
申请日：2022-06-14
发明人： Michael BRANDL , Sebastian STIGLER
IPC分类号： H05B45/22 , H05B45/325
CPC分类号： H05B45/22 , H05B45/325
摘要： A light emission arrangement includes a driver arrangement having a first, a second, and a third driver. The light emission arrangement also includes a number N of assemblies. Each assembly includes a first, a second, and a third light-emitting semiconductor body. The number N is greater than 1. The first driver is coupled to a first series connection including the first light-emitting semiconductor bodies of the number N of assemblies. The second driver is coupled to a second series connection including the second light emitting-semiconductor bodies of the number N of assemblies. The third driver is coupled to a third series connection including the third light-emitting semiconductor bodies of the number N of assemblies. The first, second, and third driver are each configured to output a driver signal dependent on photometric quantities of the first, the second, and the third light-emitting semiconductor bodies of the number N of assemblies.
-
公开(公告)号：US20240290696A1
公开(公告)日：2024-08-29
申请号：US18572709
申请日：2021-06-30
发明人： Choo Kean Lim , Ismail Ithnain , Wei Lyn Eunice Kwok , Wing Yew Wong , Heng Keong Yip , Zulhafiz Zulkifli
IPC分类号： H01L23/495 , H01L23/31
CPC分类号： H01L23/49541 , H01L23/3107
摘要： In an embodiment a lead frame sheet includes a plurality of device units, each device unit configured for an optoelectronic semiconductor device and having at least two metallic lead frame parts configured for being applied to an electric component at a top side and configured for being soldered onto an external carrier at a bottom side opposite the top side, wherein each one of the lead frame parts includes at least one bottom tie bar connecting adjacent ones of the device units, wherein, at a border line between adjacent ones of the device units, the bottom tie bars form part of the bottom side, and wherein, towards the top side, the bottom tie bars narrow such that each bottom tie bar has a local minimum or a global minimum of a width at the top side and along the border line.
-
公开(公告)号：US20240274771A1
公开(公告)日：2024-08-15
申请号：US18565453
申请日：2022-05-30
发明人： Sebastian WITTMANN , Michael BRANDL , Uli HILLER , Andreas DOBNER
IPC分类号： H01L33/62 , H01L25/075 , H01L33/56 , H01L33/60
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/56 , H01L33/60
摘要： An optoelectronic lighting device includes an at least partially transparent base body with a first main surface that is, in particular curved surface, and a second main surface. The second main surface does at least partially not extend parallel to the first main surface. A decorative layer is arranged on the curved first main surface, which substantially follows the curvature of the first main surface. An optoelectronic foil is arranged on the second main surface. The optoelectronic foil includes a carrier substrate that is, in particular a flexible carrier substrate; at least one electrical line and a plurality of optoelectronic semiconductor components arranged on the carrier substrate; and an at least partially transparent adhesive layer, which is arranged between the optoelectronic semiconductor components and the base body and which connects the optoelectronic foil to the second main surface. The optoelectronic semiconductor components are embedded in the adhesive layer.
-
-
-
-
-
-
-
-
-
搜索结果
195 条记录 (耗时 0.028 秒)
