Abstract:
An interdigitated capacitor having digits of varying width is disclosed. One embodiment of a capacitor includes a first plurality of conductive digits and a second plurality of conductive digits positioned in an interlocking manner with the first plurality of conductive digits, such that an interdigitated structure is formed. The first plurality of conductive digits and the second plurality of conductive digits collectively form a set of digits, where the width of a first digit in the set of digits is non-uniform with respect to a second digit in the set of digits.
Abstract:
An interdigitated capacitor having digits of varying width is disclosed. One embodiment of a capacitor includes a first plurality of conductive digits and a second plurality of conductive digits positioned in an interlocking manner with the first plurality of conductive digits, such that an interdigitated structure is formed. The first plurality of conductive digits and the second plurality of conductive digits collectively form a set of digits, where the width of a first digit in the set of digits is non-uniform with respect to a second digit in the set of digits.
Abstract:
An inductor structure implemented within a semiconductor integrated circuit (IC) can include a coil of conductive material that includes a center terminal located at a midpoint of a length of the coil. The coil can be symmetrical with respect to a centerline bisecting the center terminal. The coil can include a first differential terminal and a second differential terminal each located at an end of the coil and opposite the center terminal. The inductor structure can include an isolation ring surrounding the coil. In some cases, the inductor structure can include a return line of conductive material positioned on the center line.
Abstract:
An inductor structure implemented within a semiconductor integrated circuit (IC) can include a coil of conductive material that includes a center terminal located at a midpoint of a length of the coil. The coil can be symmetrical with respect to a centerline bisecting the center terminal. The coil can include a first differential terminal and a second differential terminal each located at an end of the coil and opposite the center terminal. The inductor structure can include an isolation ring surrounding the coil. In some cases, the inductor structure can include a return line of conductive material positioned on the center line.
Abstract:
An integrated circuit structure can include an interposer having a plurality of conductive layers and a die coupled to the interposer through an internal interconnect structure. The integrated circuit structure can include an inductor implemented within at least one of the conductive layers of the interposer. The inductor can include a first terminal and a second terminal. The first terminal and the second terminal can be coupled to the internal interconnect structure.
Abstract:
An inductor structure can be implemented within a semiconductor integrated circuit (IC). The inductor structure can include a coil of conductive material having a first terminal and a second terminal each located at an opposing end of the coil. The inductor structure can include a patterned ground shield including a plurality of fingers implemented within an IC process layer located between the coil of conductive material and a substrate of the IC. The inductor structure also can include an isolation wall formed to encompass the coil and the patterned ground shield. The isolation wall can be coupled to one end of each finger.
Abstract:
An inductor structure can be implemented within a semiconductor integrated circuit (IC). The inductor structure can include a coil of conductive material having a first terminal and a second terminal each located at an opposing end of the coil. The inductor structure can include a patterned ground shield including a plurality of fingers implemented within an IC process layer located between the coil of conductive material and a substrate of the IC. The inductor structure also can include an isolation wall formed to encompass the coil and the patterned ground shield. The isolation wall can be coupled to one end of each finger.