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公开(公告)号：US4889536A
公开(公告)日：1989-12-26
申请号：US372174
申请日：1989-06-27
申请人： Kazumi Naitoh , Yoshiaki Arakawa , Takashi Ikezaki , Shoji Yabe , Yutaka Yokoyama , Yuichi Hamaguchi , Yasunobu Roppongi , Yuichi Hamaguchi
发明人： Kazumi Naitoh , Yoshiaki Arakawa , Takashi Ikezaki , Shoji Yabe , Yutaka Yokoyama , Yuichi Hamaguchi , Yasunobu Roppongi , Yuichi Hamaguchi
CPC分类号： H01G9/0036 , H01G9/025 , H01G9/04 , H01G9/151 , Y10T29/417
摘要： Disclosed is a solid electrolytic capacitor having a roll-form capacitor element. The capacitor element has a coated structure comprising a valve metal positive electrode substrate having a dielectric oxide layer on the surface thereof, a semiconductor layer formed on the dielectric oxide layer and an electroconductive layer formed on the semiconductor layer.
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公开(公告)号：US20100215073A1
公开(公告)日：2010-08-26
申请号：US12706822
申请日：2010-02-17
CPC分类号： H01S5/0224 , H01L24/29 , H01L24/83 , H01L2224/83 , H01L2924/351 , H01S5/02272 , H01S5/02276 , H01S5/32341 , H01S5/405 , H01S5/4087 , H01L2924/00
摘要： A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.
摘要翻译： 提供了通过将发光元件容易地安装到支撑基底上而形成的发光器件和制造发光器件的方法。 发光装置包括：支撑基座，其在其顶表面上包括凹陷部分，所述凹陷部分在其侧壁上具有倾斜表面; 布置在所述凹陷部分的底表面上的第一发光元件; 以及布置在第一发光元件和支撑基座上的第二发光元件。
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公开(公告)号：US20080298018A1
公开(公告)日：2008-12-04
申请号：US12128142
申请日：2008-05-28
IPC分类号： H05K7/20
CPC分类号： H01S5/024 , H01S5/02423
摘要： The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.
摘要翻译： 本发明旨在通过防止由电偶腐蚀引起的水道内壁的结构的劣化来提高可靠性。 一种散热器，其中冷却流体的水通道是通过堆叠和粘合多个薄板而形成的，其中水通道中的表面由相同的金属材料制成，除了至少一端的接合部分 薄板。
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公开(公告)号：US20060227827A1
公开(公告)日：2006-10-12
申请号：US11279279
申请日：2006-04-11
IPC分类号： H01S3/04
CPC分类号： H01S5/02423 , H01L2924/0002 , H01S5/02272 , H01S5/4025 , H01L2924/00
摘要： A semiconductor laser device has a heat sink of which laminated plural plates are constituted and a semiconductor laser element mounted on upper surface of the heat sink. The heat sink has a channel in which a coolant flows inside thereof. The heat sink includes a channel-forming plate portion that forms the channel and a mounting plate portion that forms an upper surface of the heat sink that comes into contact with the channel. The mounting plate portion is made of material having a thermal expansion coefficient, which is nearer that of the semiconductor laser element than that of the channel-forming plate portion.
摘要翻译： 半导体激光装置具有构成多个板的散热片和安装在散热器的上表面上的半导体激光元件。 散热器具有冷却剂在其内部流动的通道。 散热器包括形成通道的通道形成板部分和形成与通道接触的散热器的上表面的安装板部分。 安装板部分由具有比通道形成板部分的热膨胀系数更接近于半导体激光元件的热膨胀系数的材料制成。
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5.发明授权Method of fabricating a semiconductor light emitting device with etched end surface 有权制造具有蚀刻端面的半导体发光器件的方法公开(公告)号：US06168964A
公开(公告)日：2001-01-02
申请号：US09239772
申请日：1999-01-29
申请人： Yuichi Hamaguchi
发明人： Yuichi Hamaguchi
IPC分类号： H01L2100
CPC分类号： H01L33/16 , H01L33/20 , H01S5/0281
摘要： A method of fabricating a semiconductor light emitting device includes fabricating semiconductor light emitting devices on a large scale by forming desirable end surfaces of resonators using an etching process. The method includes the steps of forming, on a base body, semiconductor layers for constituting a plurality of semiconductor light emitting devices; grooving the semiconductor layers formed on the base body in the direction from a front surface of the semiconductor layers to the base body, to form stripe-like grooves; and forming a semiconductor film in the grooves by epitaxial growth; wherein a side surface of each of the grooves, which side surface finally forms an end surface of a resonator of each of the semiconductor light emitting devices, is a crystal plane being later in epitaxial growth rate than a bottom surface of the groove.
摘要翻译： 制造半导体发光器件的方法包括通过使用蚀刻工艺形成期望的谐振器端面来大规模地制造半导体发光器件。 该方法包括以下步骤：在基体上形成用于构成多个半导体发光器件的半导体层; 在从半导体层的前表面到基体的方向上切割形成在基体上的半导体层，以形成条状槽; 以及通过外延生长在所述凹槽中形成半导体膜; 其中，每个所述凹槽的侧表面最终形成每个所述半导体发光器件的谐振器的端面是在外延生长速度晚于所述凹槽的底表面的晶面。
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公开(公告)号：US5939734A
公开(公告)日：1999-08-17
申请号：US026895
申请日：1998-02-20
申请人： Yuichi Hamaguchi
发明人： Yuichi Hamaguchi
CPC分类号： H01L33/16 , H01S5/0281 , H01L33/20
摘要： A method of fabricating a semiconductor light emitting device includes fabricating, semiconductor light emitting devices on a large scale by forming desirable end surfaces of resonators using an etching process. The method includes the steps of forming, on a base body, semiconductor layers for constituting a plurality of semiconductor light emitting devices; grooving the semiconductor layers formed on the base body in the direction from a front surface of the semiconductor layers to the base body, to form stripe-like grooves; and forming a semiconductor film in the grooves by epitaxial growth; wherein a side surface of each of the grooves, which side surface finally forms an end surface of a resonator of each of the semiconductor light emitting devices, is a crystal plane being later in epitaxial growth rate than a bottom surface of the groove.
摘要翻译： 制造半导体发光器件的方法包括通过使用蚀刻工艺形成期望的谐振器端面来大规模地制造半导体发光器件。 该方法包括以下步骤：在基体上形成用于构成多个半导体发光器件的半导体层; 在从半导体层的前表面到基体的方向上切割形成在基体上的半导体层，以形成条状槽; 以及通过外延生长在所述凹槽中形成半导体膜; 其中，每个所述凹槽的侧表面最终形成每个所述半导体发光器件的谐振器的端面是在外延生长速度晚于所述凹槽的底表面的晶面。
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公开(公告)号：US20120291995A1
公开(公告)日：2012-11-22
申请号：US13564250
申请日：2012-08-01
IPC分类号： F28D15/00
CPC分类号： H01S5/024 , H01S5/02423
摘要： The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.
摘要翻译： 本发明旨在通过防止由电偶腐蚀引起的水道内壁的结构的劣化来提高可靠性。 一种散热器，其中冷却流体的水通道是通过堆叠和粘合多个薄板而形成的，其中水通道中的表面由相同的金属材料制成，除了至少一端的接合部分 薄板。
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公开(公告)号：US08264841B2
公开(公告)日：2012-09-11
申请号：US12128142
申请日：2008-05-28
CPC分类号： H01S5/024 , H01S5/02423
摘要： The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.
摘要翻译： 本发明旨在通过防止由电偶腐蚀引起的水道内壁的结构的劣化来提高可靠性。 一种散热器，其中冷却流体的水通道是通过堆叠和粘合多个薄板而形成的，其中水通道中的表面由相同的金属材料制成，除了至少一端的接合部分 薄板。
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公开(公告)号：US08654810B2
公开(公告)日：2014-02-18
申请号：US12706822
申请日：2010-02-17
IPC分类号： H01S5/00
CPC分类号： H01S5/0224 , H01L24/29 , H01L24/83 , H01L2224/83 , H01L2924/351 , H01S5/02272 , H01S5/02276 , H01S5/32341 , H01S5/405 , H01S5/4087 , H01L2924/00
摘要： A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.
摘要翻译： 提供了通过将发光元件容易地安装到支撑基底上而形成的发光器件和制造发光器件的方法。 发光装置包括：支撑基座，其在其顶表面上包括凹陷部分，所述凹陷部分在其侧壁上具有倾斜表面; 布置在所述凹陷部分的底表面上的第一发光元件; 以及布置在第一发光元件和支撑基座上的第二发光元件。
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公开(公告)号：US20110006664A1
公开(公告)日：2011-01-13
申请号：US12888653
申请日：2010-09-23
申请人： Yuichi Hamaguchi , Noriyuki Banno
发明人： Yuichi Hamaguchi , Noriyuki Banno
CPC分类号： H01S5/4025 , G11B7/1275 , G11B2007/0006 , H01S5/02 , H01S5/4087
摘要： The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.
摘要翻译： 本发明提供一种解决由第一和第二发光元件之间的结合引起的弱点的发光器件及其制造方法。 芯片形的第一发光元件和彼此重叠的第二发光元件设置在支撑基座上。 四个岛形突起设置在支撑基座的顶面上，并支撑第二发光元件。 通过对支撑基底进行湿式蚀刻或干法蚀刻来形成突起，并且在突起的顶面上设置焊盘电极。 焊盘电极电连接到第二发光元件并且还电连接到电线。
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