Signal and image analysis method and ultrasound imaging system
    1.
    发明授权
    Signal and image analysis method and ultrasound imaging system 有权
    信号和图像分析方法和超声成像系统

    公开(公告)号:US08837798B2

    公开(公告)日:2014-09-16

    申请号:US13553793

    申请日:2012-07-19

    CPC classification number: A61B8/06 A61B8/488 A61B8/5223

    Abstract: A time domain signal analysis method is provided. The signal analysis method includes the following steps. A signal to be analyzed is received. The signal to be analyzed is iteratively sifted by using Empirical Mode Decomposition (EMD) to extract at least one intrinsic function (IMF). A normalized Hilbert transform is performed on the IMF. The transformed IMF includes phase information. The transformed IMF is processed by means of phase processing to obtain the processed IMF including angular frequency information. The foregoing signal analysis method could be utilized in an ultrasound imaging system to identify image information of ultrasound images.

    Abstract translation: 提供了时域信号分析方法。 信号分析方法包括以下步骤。 接收待分析的信号。 通过使用经验模式分解(EMD)来提取至少一个内在函数(IMF)来迭代地筛选待分析的信号。 在IMF上执行归一化希尔伯特变换。 经转换的IMF包括阶段信息。 通过相位处理来处理变换的IMF,以获得包括角频率信息的经处理的IMF。 上述信号分析方法可用于超声成像系统中以识别超声图像的图像信息。

    DICING PROCESS AND DICING APPARATUS
    3.
    发明申请
    DICING PROCESS AND DICING APPARATUS 审中-公开
    定义流程和定位设备

    公开(公告)号:US20130029476A1

    公开(公告)日:2013-01-31

    申请号:US13540781

    申请日:2012-07-03

    CPC classification number: B28D5/0011 B28D5/0052 Y02P80/30

    Abstract: A dicing process is provided for cutting a wafer along a plurality of predetermined scribe lines into a plurality of dies that are releasably adhered to a release film. The dicing process includes: (a) disposing a wafer-breaking carrier on a supporting device, the wafer-breaking carrier having a chipping unit; (b) disposing the wafer above the supporting device such that the chipping unit is at a position corresponding to the scribe lines; and (c) adhering a release surface of the release film to the wafer by applying a force to the release film to contact the chipping unit of the wafer-breaking carrier with the wafer, such that the wafer is split along the scribe lines into the dies.

    Abstract translation: 提供了一种切割工艺,用于沿着多条预定划线将晶片切割成可剥离地粘附到脱模膜上的多个模具。 切割工艺包括:(a)在支撑装置上设置晶片破坏载体,晶片断开载体具有切屑单元; (b)将所述晶片设置在所述支撑装置上方,使得所述切屑单元处于与所述划线对应的位置; 并且(c)通过向剥离膜施加力使脱模膜的释放表面附着到晶片上,以将晶片破坏载体的切屑单元与晶片接触,使得晶片沿着划线分裂成 死了

    LIQUID CRYSTAL DISPLAY APPARATUS, BACKLIGHT MODULE AND LIGHT SOURCE DRIVING DEVICE THEREOF
    5.
    发明申请
    LIQUID CRYSTAL DISPLAY APPARATUS, BACKLIGHT MODULE AND LIGHT SOURCE DRIVING DEVICE THEREOF 审中-公开
    液晶显示装置,背光模组及其光源驱动装置

    公开(公告)号:US20080231621A1

    公开(公告)日:2008-09-25

    申请号:US12027891

    申请日:2008-02-07

    CPC classification number: G09G3/342 G09G2320/041 G09G2320/064

    Abstract: A light source driving device for driving a plurality of light-emitting units includes a power supply unit and a feedback control unit. The power supply unit is electrically connected to the light-emitting units and outputs a driving signal for driving the light-emitting units. The feedback control unit is electrically connected to the power supply unit and between any two light-emitting units, and retrieves a feedback signal from the light-emitting units to generate a pulse width modulation (PWM) signal for controlling the light-emitting units.

    Abstract translation: 用于驱动多个发光单元的光源驱动装置包括电源单元和反馈控制单元。 电源单元电连接到发光单元,并输出用于驱动发光单元的驱动信号。 反馈控制单元电连接到电源单元和任何两个发光单元之间,并且从发光单元检索反馈信号以产生用于控制发光单元的脉宽调制(PWM)信号。

    Protection circuit
    6.
    发明授权
    Protection circuit 失效
    保护电路

    公开(公告)号:US07397643B2

    公开(公告)日:2008-07-08

    申请号:US11334412

    申请日:2006-01-19

    CPC classification number: H02H3/20 H02H3/066

    Abstract: A protection circuit is coupled between a secondary winding of a transformer and a load. When voltage at the secondary winding of the transformer becomes abnormal, the protection circuit disconnects the power connection to the load so as to protect the load from damage. When the voltage at the secondary winding of the transformer returns normal, the protection circuit restores power to the load.

    Abstract translation: 保护电路耦合在变压器的次级绕组和负载之间。 当变压器次级绕组的电压异常时,保护电路断开与负载的电源连接,以保护负载免受损坏。 当变压器次级绕组的电压恢复正常时,保护电路恢复负载的电力。

    Imaging system and image processing method thereof
    8.
    发明授权
    Imaging system and image processing method thereof 有权
    成像系统及其图像处理方法

    公开(公告)号:US08744128B2

    公开(公告)日:2014-06-03

    申请号:US13558362

    申请日:2012-07-26

    CPC classification number: A61B8/5207 A61B8/08 A61B8/461 A61B8/5215

    Abstract: An image processing method is provided. The image processing method includes the following steps. A plurality of raw signal is received by a signal transceiving module of the ultrasound imaging system. It is determined whether each of the raw signals satisfies any condition in a condition group, and the raw signal satisfying any condition in the condition group is mapped to one of a plurality of preset constants to generate a plurality of first data. The raw signals not satisfying any condition in the condition group are processed according to a calculation formula to generate a plurality of second data. A beamforming procedure is simultaneously performed on the first and second data to obtain a beamformed image. The beamformed image is transformed to obtain an image of a region to be detected. Furthermore, an imaging system using the foregoing image processing method is also provided.

    Abstract translation: 提供了图像处理方法。 图像处理方法包括以下步骤。 多个原始信号由超声波成像系统的信号收发模块接收。 确定每个原始信号是否满足条件组中的任何条件,并且满足条件组中的任何条件的原始信号被映射到多个预设常数中的一个以产生多个第一数据。 根据计算公式处理条件组中不满足任何条件的原始信号,以生成多个第二数据。 对第一和​​第二数据同时执行波束形成过程以获得波束形成的图像。 波束形成的图像被变换以获得要检测的区域的图像。 此外,还提供了使用上述图像处理方法的成像系统。

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