公开(公告)号：US20120329263A1

公开(公告)日：2012-12-27

申请号：US13293804

申请日：2011-11-10

Applicant: Yi-Mang CHOU ,  Yian-Liang KUO

Inventor： Yi-Mang CHOU ,  Yian-Liang KUO

IPC: H01L21/768

CPC classification number: H01L24/05 ,  H01L24/06 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05562 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/0615 ,  H01L2924/3511 ,  H01L2924/35121

Abstract: A method for the fabrication of a semiconductor chip, comprises forming one or more semiconductor devices on a substrate; forming a passivation layer on the substrate; forming a plurality of bond pads on the passivation layer; and forming a plurality of under-bump metallurgy (UBM) layers on respective ones of the plurality of bond pads, wherein at least one of the bond pads has an elongated shape having an elongated portion and a contracted portion, the elongated portion oriented substantially along a stress direction radiating from a center of the chip to the periphery thereof.

Abstract translation: 一种用于制造半导体芯片的方法，包括在衬底上形成一个或多个半导体器件; 在衬底上形成钝化层; 在所述钝化层上形成多个接合焊盘; 以及在所述多个接合焊盘的相应的多个接合焊盘上形成多个凸起下的金属（UBM）层，其中所述接合焊盘中的至少一个具有细长形状，其具有细长部分和收缩部分，所述细长部分基本上沿着 从芯片的中心向其周边辐射的应力方向。

公开(公告)号：US09053943B2

公开(公告)日：2015-06-09

申请号：US13167906

申请日：2011-06-24

Applicant: Yi-Mang Chou ,  Yian-Liang Kuo

Inventor： Yi-Mang Chou ,  Yian-Liang Kuo

IPC: H01L23/528 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L24/06 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05555 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/0613 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2924/00012

Abstract: A bond pad design comprises a plurality of bond pads on a semiconductor chip and a plurality of under-bump metallurgy (UBM) layers formed on respective bond pads of the plurality. At least one of the bond pads has an elongated shape having an elongated portion and a contracted portion, the elongated portion oriented substantially along a stress direction radiating from a center to the periphery of the chip.

Abstract translation: 接合焊盘设计包括半导体芯片上的多个接合焊盘和形成在多个焊盘上的多个凸点下的冶金（UBM）层。 至少一个接合焊盘具有细长形状，具有细长部分和收缩部分，细长部分基本上沿着从芯片的中心辐射到外围的应力方向取向。

公开(公告)号：US20120326336A1

公开(公告)日：2012-12-27

申请号：US13167906

申请日：2011-06-24

Applicant: Yi-Mang CHOU ,  Yian-Liang KUO

Inventor： Yi-Mang CHOU ,  Yian-Liang KUO

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L24/06 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05555 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/0613 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2924/00012

Abstract: A bond pad design comprises a plurality of bond pads on a semiconductor chip and a plurality of under-bump metallurgy (UBM) layers formed on respective bond pads of the plurality. At least one of the bond pads has an elongated shape having an elongated portion and a contracted portion, the elongated portion oriented substantially along a stress direction radiating from a center to the periphery of the chip.

Abstract translation: 接合焊盘设计包括半导体芯片上的多个接合焊盘和形成在多个焊盘上的多个凸点下的冶金（UBM）层。 至少一个接合焊盘具有细长形状，具有细长部分和收缩部分，细长部分基本上沿着从芯片的中心辐射到外围的应力方向取向。