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公开(公告)号：US6049290A
公开(公告)日：2000-04-11
申请号：US874824
申请日：1997-06-13
Applicant: Whitfield G. Halstead
Inventor： Whitfield G. Halstead
CPC classification number: H04B1/086
Abstract: A pager including a housing and a control button interface, where the housing has an opening having at least one recess area around a portion of the opening and the control button interface is coupled to the housing and has multiple buttons arranged with at least one of the controlled buttons positioned between the other buttons. One of the buttons is located near the one recess area so as to enable its depression without causing other buttons from being depressed.
Abstract translation: 一种包括壳体和控制按钮接口的寻呼机，其中壳体具有开口，该开口具有围绕开口的一部分的至少一个凹部区域，并且控制按钮接口联接到壳体并且具有布置成具有至少一个 控制按钮位于其他按钮之间。 其中一个按钮位于一个凹槽区域附近，以便使其能够按压而不会使其他按钮被压下。
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公开(公告)号：US08586857B2
公开(公告)日：2013-11-19
申请号：US12264712
申请日：2008-11-04
Applicant: Shawn Everson , Steven T. Croft , Whitfield G. Halstead , Jason S. Corneille
Inventor： Shawn Everson , Steven T. Croft , Whitfield G. Halstead , Jason S. Corneille
IPC: H01L31/05
CPC classification number: H01L24/83 , H01L24/33 , H01L2224/27013 , H01L2224/29109 , H01L2224/32245 , H01L2224/83051 , H01L2224/83385 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/12036 , H01L2924/19043 , H02S40/34 , H02S40/345 , H01L2924/3512 , H01L2924/00
Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.
Abstract translation: 一个组合的二极管，引线组件，包含两个伸缩接头。 包括两个扩展接头的组合二极管引线组件包括具有第一二极管端子和第二二极管端子的二极管，第一导体和第二导体。 第一导体包括在第一二极管端子处电耦合到二极管的第一端子和被配置为第一扩张接头的第二端子，其被配置为电耦合到第一互连导体并且被配置为减少 由第一导体施加到二极管的应力。 第二导体包括在第二二极管端子处电耦合到二极管的第一端子和被配置为第二扩展接头的第二端子，该第二端子被配置为电耦合到第二互连导体并且被配置为减少 由第二导体施加到二极管的应力。
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公开(公告)号：US20100108122A1
公开(公告)日：2010-05-06
申请号：US12264712
申请日：2008-11-04
Applicant: Shawn Everson , Steven T. Croft , Whitfield G. Halstead , Jason S. Corneille
Inventor： Shawn Everson , Steven T. Croft , Whitfield G. Halstead , Jason S. Corneille
CPC classification number: H01L24/83 , H01L24/33 , H01L2224/27013 , H01L2224/29109 , H01L2224/32245 , H01L2224/83051 , H01L2224/83385 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/12036 , H01L2924/19043 , H02S40/34 , H02S40/345 , H01L2924/3512 , H01L2924/00
Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.
Abstract translation: 一个组合的二极管，引线组件，包含两个伸缩接头。 包括两个扩展接头的组合二极管引线组件包括具有第一二极管端子和第二二极管端子的二极管，第一导体和第二导体。 第一导体包括在第一二极管端子处电耦合到二极管的第一端子和被配置为第一扩张接头的第二端子，其被配置为电耦合到第一互连导体并且被配置为减少 由第一导体施加到二极管的应力。 第二导体包括在第二二极管端子处电耦合到二极管的第一端子和被配置为第二扩展接头的第二端子，该第二端子被配置为电耦合到第二互连导体并且被配置为减少 由第二导体施加到二极管的应力。
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公开(公告)号：US08203200B2
公开(公告)日：2012-06-19
申请号：US12626281
申请日：2009-11-25
Applicant: Whitfield G. Halstead , Steven Croft , Shawn Everson
Inventor： Whitfield G. Halstead , Steven Croft , Shawn Everson
IPC: H01L23/498
CPC classification number: H01L24/34 , H01L23/3107 , H01L23/49551 , H01L23/49568 , H01L23/562 , H01L24/37 , H01L31/044 , H01L2224/32245 , H01L2224/37599 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/12036 , H01L2924/15747 , Y02E10/50 , H01L2924/00 , H01L2224/37099
Abstract: A leadframe design for a diode or other semiconductor device that reduces stress on the device and provides increased heat dissipation is provided. According to various embodiments, the leadframe has a contoured profile including a recessed area and a raised surface within the recessed area. The surface supports the device such that the edges of the device extend past the surface. Also provided are device assemblies including the novel leadframes. In certain embodiments, the assemblies include one or more leadframes attached via a solder joint to a device. According to various embodiments, the leadframes are attached to the front side of the device, back side of the device or both. In particular embodiments, the device is a bypass diode for one or more solar cells in a solar module.
Abstract translation: 提供了一种二极管或其他半导体器件的引线框设计，可减少器件上的应力并提高散热。 根据各种实施例，引线框架具有包括凹陷区域和凹陷区域内的凸起表面的波形轮廓。 表面支撑设备，使得设备的边缘延伸越过表面。 还提供了包括新型引线框架的器件组件。 在某些实施例中，组件包括经由焊接接头连接到设备的一个或多个引线框架。 根据各种实施例，引线框架附接到设备的前侧，设备的背面或两者。 在具体实施例中，该装置是用于太阳能模块中的一个或多个太阳能电池的旁路二极管。
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公开(公告)号：USD415762S
公开(公告)日：1999-10-26
申请号：US76984
申请日：1997-09-22
Applicant: Whitfield G. Halstead , Henry Madden
Designer： Whitfield G. Halstead , Henry Madden
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Patent Agency Ranking
公开(公告)号：USD409195S
公开(公告)日：1999-05-04
申请号：US72280
申请日：1997-06-13
Applicant: Whitfield G. Halstead , Henry Madden
Designer： Whitfield G. Halstead , Henry Madden
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7.发明授权Mechanism for nesting an optical fiber in an optical coupler and providing positive stop opening and closing positions for the coupler 失效在光耦合器中嵌套光纤并为耦合器提供正向停止打开和关闭位置的机构
公开(公告)号：US5016969A
公开(公告)日：1991-05-21
申请号：US399684
申请日：1989-08-28
Applicant: Louis S. Saiia , Whitfield G. Halstead
Inventor： Louis S. Saiia , Whitfield G. Halstead
CPC classification number: G02B6/4292 , G02B6/4201 , G02B6/424 , G02B6/3636
Abstract: An optical coupler for coupling light between an optical fiber core and an electrooptic transducer includes a pin and channel arrangement associated with a mechanism for opening and closing the coupler. At one position the pin engages an end of the channel whereat the coupler is open and safe insertion or removal of the fiber from the coupler is possible. At a second position, the pin engages another end of the channel and an optical fiber previously inserted into the coupler when in its open position is securely locked in the optical coupler.
Abstract translation: 用于在光纤芯和电光换能器之间耦合光的光耦合器包括与用于打开和闭合耦合器的机构相关联的销和通道布置。 在一个位置，销接合通道的端部，耦合器打开，并且可以从耦合器安全插入或移除光纤。 在第二位置，销接合通道的另一端，并且当处于其打开位置时预先插入耦合器中的光纤牢固地锁定在光耦合器中。
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公开(公告)号：USD388059S
公开(公告)日：1997-12-23
申请号：US45104
申请日：1995-10-10
Applicant: Whitfield G. Halstead , Henry Madden
Designer： Whitfield G. Halstead , Henry Madden
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公开(公告)号：US20110121441A1
公开(公告)日：2011-05-26
申请号：US12626281
申请日：2009-11-25
Applicant: Whitfield G. Halstead , Steven Croft , Shawn Everson
Inventor： Whitfield G. Halstead , Steven Croft , Shawn Everson
IPC: H01L23/495 , H01L21/50
CPC classification number: H01L24/34 , H01L23/3107 , H01L23/49551 , H01L23/49568 , H01L23/562 , H01L24/37 , H01L31/044 , H01L2224/32245 , H01L2224/37599 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/12036 , H01L2924/15747 , Y02E10/50 , H01L2924/00 , H01L2224/37099
Abstract: A leadframe design for a diode or other semiconductor device that reduces stress on the device and provides increased heat dissipation is provided. According to various embodiments, the leadframe has a contoured profile including a recessed area and a raised surface within the recessed area. The surface supports the device such that the edges of the device extend past the surface. Also provided are device assemblies including the novel leadframes. In certain embodiments, the assemblies include one or more leadframes attached via a solder joint to a device. According to various embodiments, the leadframes are attached to the front side of the device, back side of the device or both. In particular embodiments, the device is a bypass diode for one or more solar cells in a solar module.
Abstract translation: 提供了一种二极管或其他半导体器件的引线框设计，可减少器件上的应力并提高散热。 根据各种实施例，引线框架具有包括凹陷区域和凹陷区域内的凸起表面的波形轮廓。 表面支撑设备，使得设备的边缘延伸越过表面。 还提供了包括新型引线框架的器件组件。 在某些实施例中，组件包括经由焊接接头连接到设备的一个或多个引线框架。 根据各种实施例，引线框架附接到设备的前侧，设备的背面或两者。 在具体实施例中，该装置是用于太阳能模块中的一个或多个太阳能电池的旁路二极管。
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公开(公告)号：USD410926S
公开(公告)日：1999-06-15
申请号：US77254
申请日：1997-09-22
Applicant: Whitfield G. Halstead , Henry Madden
Designer： Whitfield G. Halstead , Henry Madden
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