公开(公告)号：US06316747B1

公开(公告)日：2001-11-13

申请号：US09623841

申请日：2000-10-06

Applicant: Werner Blersch ,  Heinrich Walk

Inventor： Werner Blersch ,  Heinrich Walk

IPC: F27B514

CPC classification number: H01L21/67115

Abstract: An apparatus for the thermal treatment of substrates is provided. The apparatus includes a reaction chamber, at least one elongated heat source, and at least one reflection wall that is disposed adjacent to the heat source and serves to reflect at least a portion of the radiation given off thereby. The reflection wall has at least one rib, and the heat source is disposed at an oblique angle to the longitudinal direction of the rib.

Abstract translation: 提供了一种用于基板的热处理的装置。 该设备包括反应室，至少一个细长的热源，以及至少一个反射壁，该反射壁邻近热源设置并用于反射由此释放的辐射的至少一部分。 反射壁具有至少一个肋，并且热源设置成与肋的纵向方向成倾斜的角度。

公开(公告)号：US06775471B2

公开(公告)日：2004-08-10

申请号：US10332119

申请日：2003-03-05

Applicant: Werner Blersch ,  Jochen Urban ,  Silke Paul ,  Uwe Ruby ,  Markus Hauf

Inventor： Werner Blersch ,  Jochen Urban ,  Silke Paul ,  Uwe Ruby ,  Markus Hauf

IPC: F26B330

CPC classification number: G05D23/1904 ,  G05D23/1917

Abstract: The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.

Abstract translation: 本发明涉及一种用于热处理物体的方法和装置。 本发明的目的是有助于更好地控制待热处理的物体的温度分布。 为此，本发明提供了一种用于热处理加热系统中的物体的方法和装置，特别是用于处理快速加热系统（1）中的半导体晶片（2）。 物体以预定的温度进行热处理，并且通过基于加热系统和物体的模拟模型的PID控制和前馈控制来控制物体的温度。 所述模型由加热系统和/或物体的各个部件组成。 在热处理期间监测至少一个单独模型的参数，并且模型适应于所监测的参数。

公开(公告)号：US06311016B1

公开(公告)日：2001-10-30

申请号：US09171786

申请日：1999-05-07

Applicant: Syusaku Yanagawa ,  Werner Blersch

Inventor： Syusaku Yanagawa ,  Werner Blersch

IPC: A21B200

CPC classification number: H01L21/67248 ,  G01K1/20 ,  H01L21/67098 ,  H01L21/67115

Abstract: A temperature measuring apparatus, for measuring a temperature of a substrate in a heating apparatus heating a substrate by irradiation of light, and a method for measuring a substrate temperature, the measuring apparatus having a thermocouple and a covering member for covering it. The covering member portion covering the thermocouple is made of a material with a high heat conductivity and its excluding the material with a high heat conductivity portion is made of a material with a high light reflection factor respectively, whereby it is possible to accurately measure the temperature of the substrate heated by irradiation light without the measurement being affected by the heating irradiation light and without contaminating the substrate and further, without depending on film thicknesses structure of the substrate.

Abstract translation: 一种温度测量装置，用于测量通过照射光照射基板的加热装置中的基板的温度，以及用于测量基板温度的方法，所述测量装置具有热电偶和覆盖部件。 覆盖热电偶的覆盖部分由具有高导热性的材料制成，并且除了具有高导热率部分的材料分别由具有高光反射率的材料制成，由此可以精确地测量温度 通过照射光加热的基板，而不会受到加热照射光的影响，并且不会污染基板，而不依赖于基板的膜厚结构。

公开(公告)号：US5965047A

公开(公告)日：1999-10-12

申请号：US960150

申请日：1997-10-24

Applicant: Werner Blersch ,  Peter Gruenwald ,  Michael Maurer ,  Helmut Merkle ,  Thomas Theiler ,  Heinrich Walk

Inventor： Werner Blersch ,  Peter Gruenwald ,  Michael Maurer ,  Helmut Merkle ,  Thomas Theiler ,  Heinrich Walk

IPC: H01L21/26 ,  H01L21/00 ,  C23C16/00

CPC classification number: H01L21/67115

Abstract: A rapid thermal processing (RTP) chamber, wherein one wall of the chamber supporting a substrate rotates with respect to the rest of the chamber so that the substrate being treated in the RTP chamber is relatively rotated with respect to the lamps heating the substrate.

Abstract translation: 快速热处理（RTP）室，其中支撑衬底的室的一个壁相对于室的其余部分旋转，使得在RTP室中被处理的衬底相对于加热衬底的灯相对旋转。

公开(公告)号：US20050272474A1

公开(公告)日：2005-12-08

申请号：US10860479

申请日：2004-06-03

Applicant: Werner Blersch

Inventor： Werner Blersch

IPC: H04B1/38 ,  H04M1/00 ,  H04M1/22 ,  H04M1/725

CPC classification number: H04M1/22 ,  H04M1/72544

Abstract: A hand-portable electronic device having an exterior and comprising: a display; at least one light emitting device distinct from the display; means for controlling the presentation of a image on the display; means for determining a first color value that is dependent upon the image; means for converting the first color value to a color control signal; and means for controlling the at least one light emitting device, in response to the color control signal, to emit colored light from at least a portion of the exterior of the hand-portable electronic device.

Abstract translation: 一种具有外部的便携式电子设备，包括：显示器; 与显示器不同的至少一个发光器件; 用于控制显示器上的图像呈现的装置; 用于确定依赖于图像的第一颜色值的​​装置; 用于将第一颜色值转换为颜色控制信号的装置; 以及用于响应于所述颜色控制信号来控制所述至少一个发光器件从所述手持式电子设备的外部的至少一部分发射有色光的装置。

公开(公告)号：US06903262B2

公开(公告)日：2005-06-07

申请号：US10498473

申请日：2001-12-17

Applicant: Werner Blersch

Inventor： Werner Blersch

IPC: H05K9/00

CPC classification number: H05K9/0032

Abstract: The present invention relates to a shielding element for electric and/or electronic components of an electric and/or electronic circuit, including an annular side wall (11) for surrounding those elements (25) of a circuit that have to be shielded against electromagnetic radiation, said side wall (11) defining a bottom and a ceiling opening (15), and a cover (12, 12′) for closing the ceiling opening (15). To provide a shielding element that facilitates a sampling of an electric and/or electronic circuit arrangement said cover (12, 12′) is either detachable attached to said side wall (11) by joint means that comprises a predetermined breaking (26) line or defined together with said side wall (11) as parts of an integral cap (32) by a predetermined breaking line (26). In both cases said predetermined breaking line (26) has to be destroyed for detaching said cover (12, 12′) from said side wall (11).

Abstract translation: 本发明涉及一种用于电气和/或电子电路的电气和/或电子部件的屏蔽元件，包括环形侧壁（11），用于围绕必须屏蔽电磁辐射的电路元件（25） ，所述侧壁（11）限定底部和天花板开口（15），以及用于封闭天花板开口（15）的盖（12,12'）。 为了提供便于对电气和/或电子电路装置进行取样的屏蔽元件，所述盖子（12,12'）可通过包括预定的断裂线（26）线的接合装置可拆卸地附接到所述侧壁（11） 与所述侧壁（11）一起被定义为通过预定断裂线（26）的整体盖（32）的部分。 在两种情况下，为了从所述侧壁（11）分离所述盖（12,12'），所述预定断裂线（26）必须被破坏。

公开(公告)号：US06614005B1

公开(公告)日：2003-09-02

申请号：US09979646

申请日：2001-12-13

Applicant: Heinrich Walk ,  Roland Mader ,  Werner Blersch ,  Markus Hauf

Inventor： Heinrich Walk ,  Roland Mader ,  Werner Blersch ,  Markus Hauf

IPC: F27B514

CPC classification number: H01L21/2686 ,  H01L21/67115 ,  H05B3/0047

Abstract: The aim of the invention is to provide an economical and homogenous thermal treatment for substrate. To this end, the inventive device and method for thermally treating substrates, especially semiconductor wafers, comprise at least one heating device for heating at least one substrate by electromagnetic radiation. Said heating device comprises at least two arc lamps, the radiation characteristics for each arc lamp being controlled individually, and the electromagnetic radiation of the arc lamps contributing essentially to the power density of the electromagnetic radiation of the heating device.

Abstract translation: 本发明的目的是为基材提供经济和均匀的热处理。 为此，用于热处理基板，特别是半导体晶片的本发明的装置和方法包括用于通过电磁辐射加热至少一个基板的至少一个加热装置。 所述加热装置包括至少两个弧光灯，每个弧光灯的辐射特性被单独控制，并且电弧灯的电磁辐射基本上有助于加热装置的电磁辐射的功率密度。

公开(公告)号：US20050068758A1

公开(公告)日：2005-03-31

申请号：US10498473

申请日：2001-12-17

Applicant: Werner Blersch

Inventor： Werner Blersch

IPC: H05K9/00

CPC classification number: H05K9/0032

Abstract: The present invention relates to a shielding element for electric and/or electronic components of an electric and/or electronic circuit, comprising an annular side wall (11) for surrounding those elements (25) of a circuit that have to be shielded against electromagnetic radiation, said side wall (11) defining a bottom and a ceiling opening (15), and a cover (12, 12′) for closing the ceiling opening (15). To provide a shielding element that facilitates a sampling of an electric and/or electronic circuit arrangement said cover (12, 12′) is either detachable attached to said side wall (11) by joint means that comprises a predetermined breaking (26) line or defined together with said side wall (11) as parts of an integral cap (32) by a predetermined breaking line (26). In both cases said predetermined breaking line (26) has to be destroyed for detaching said cover (12, 12′) from said side wall (11).

Abstract translation: 本发明涉及一种用于电气和/或电子电路的电气和/或电子部件的屏蔽元件，包括用于围绕必须屏蔽电磁辐射的电路元件（25）的环形侧壁（11） ，所述侧壁（11）限定底部和天花板开口（15），以及用于封闭天花板开口（15）的盖（12,12'）。 为了提供便于对电气和/或电子电路装置进行取样的屏蔽元件，所述盖子（12,12'）可通过包括预定的断裂线（26）线的接合装置可拆卸地附接到所述侧壁（11） 与所述侧壁（11）一起被定义为通过预定断裂线（26）的整体盖（32）的部分。 在两种情况下，为了从所述侧壁（11）分离所述盖（12,12'），所述预定断裂线（26）必须被破坏。