公开(公告)号：US08736925B2

公开(公告)日：2014-05-27

申请号：US13696206

申请日：2011-05-03

申请人： Frederic Mayer ,  Vincent Hibon ,  Henri Bugnet ,  Joel Vaillant

发明人： Frederic Mayer ,  Vincent Hibon ,  Henri Bugnet ,  Joel Vaillant

IPC分类号： H04N1/04 ,  H04N1/387 ,  G01B11/30 ,  G06K9/40 ,  G06K9/36 ,  G06K7/10

CPC分类号： H04N5/37206 ,  H04N5/37213

摘要： The invention relates to scanning linear image sensors with signal integration, in which an image of a line of points from an observed scene is reconstructed by the addition of successive images taken by a plurality of photosensitive lines which successively observe the same line of the scene as the scene moves across the sensor perpendicularly to the lines. The sensor according to the invention uses charge transfer pixels (Pm,i,j) grouped into M groups of N lines; an analog charge summation is carried out in each group; and the results of this summation are read by read circuits (READm) associated with each group, and then digitized and added to those of the other groups.

摘要翻译： 本发明涉及扫描具有信号积分的线性图像传感器，其中通过添加由多个感光线拍摄的连续图像来重建来自观察场景的点线的图像，其连续观察场景的相同行，如 场景横跨传感器垂直于线路移动。 根据本发明的传感器使用分组为N组的M组的电荷转移像素（Pm，i，j） 在每组中进行模拟电荷求和; 并且该求和的结果由与每个组相关联的读取电路（READm）读取，然后被数字化并添加到其他组的结果。

公开(公告)号：US20130057931A1

公开(公告)日：2013-03-07

申请号：US13696206

申请日：2011-05-03

申请人： Frederic Mayer ,  Vincent Hibon ,  Henri Bugnet ,  Joel Vaillant

发明人： Frederic Mayer ,  Vincent Hibon ,  Henri Bugnet ,  Joel Vaillant

IPC分类号： H04N1/04

CPC分类号： H04N5/37206 ,  H04N5/37213

摘要： The invention relates to scanning linear image sensors with signal integration, in which an image of a line of points from an observed scene is reconstructed by the addition of successive images taken by a plurality of photosensitive lines which successively observe the same line of the scene as the scene moves across the sensor perpendicularly to the lines. The sensor according to the invention uses charge transfer pixels (Pm,i,j) grouped into M groups of N lines; an analog charge summation is carried out in each group; and the results of this summation are read by read circuits (READm) associated with each group, and then digitized and added to those of the other groups.

摘要翻译： 本发明涉及扫描具有信号积分的线性图像传感器，其中通过添加由多个感光线拍摄的连续图像来重建来自观察场景的点线的图像，其连续观察场景的相同行，如 场景横跨传感器垂直于线路移动。 根据本发明的传感器使用分组为N组的M组的电荷转移像素（Pm，i，j） 在每组中进行模拟电荷求和; 并且该求和的结果由与每个组相关联的读取电路（READm）读取，然后被数字化并添加到其他组的结果。

公开(公告)号：US20110024744A1

公开(公告)日：2011-02-03

申请号：US12845166

申请日：2010-07-28

申请人： Pierre FEREYRE ,  Vincent HIBON ,  Yann HENRION ,  Patrick LARIVIERE

发明人： Pierre FEREYRE ,  Vincent HIBON ,  Yann HENRION ,  Patrick LARIVIERE

IPC分类号： H01L23/58

CPC分类号： H01L24/05 ,  H01L22/32 ,  H01L23/481 ,  H01L24/45 ,  H01L27/1464 ,  H01L27/14683 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to electronic components on thinned substrates, for example image sensors. Preferably, connection pads are connected through the thinned substrate to underlying layers and notably to a test pad by way of openings through which the metal of the pad passes. The openings are elongate openings extending along one edge of the pad of rectangular shape and a circular area of at least 50% (and preferably 65 to 75%) of the area of the pad contains no opening for connection with the underlying layers. This circular area is intended for bonding an external connection wire. The connection pads are testable from the back side by test probes and the front side may be tested (before bonding and thinning) by test probes with the same geometric configuration.

摘要翻译： 本发明涉及薄型衬底上的电子元件，例如图像传感器。 优选地，连接焊盘通过薄的衬底连接到下面的层，并且特别地通过焊盘的金属通过的开口显着地连接到测试焊盘。 这些开口是沿矩形形状的垫的一个边缘延伸的细长开口，并且垫的面积的至少50％（优选地65-75％）的圆形区域不包含用于与下面的层连接的开口。 该圆形区域用于粘合外部连接线。 连接垫可以通过测试探头从背面进行测试，并且前侧可以通过具有相同几何构型的测试探针进行测试（在粘合和变薄之前）。