COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
    1.
    发明申请
    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
    用于移动电子系统的冷却泵送系统

    公开(公告)号:US20120273183A1

    公开(公告)日:2012-11-01

    申请号:US13546612

    申请日:2012-07-11

    IPC分类号: F28F27/00

    CPC分类号: H05K7/20272 H05K7/20872

    摘要: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.

    摘要翻译: 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器,流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个,质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。 齿轮构件可操作地连接在质量块和力传递构件之间。

    HEAT SPREADER
    3.
    发明申请
    HEAT SPREADER 审中-公开
    散热器

    公开(公告)号:US20130008632A1

    公开(公告)日:2013-01-10

    申请号:US13613881

    申请日:2012-09-13

    IPC分类号: F28D15/00

    摘要: A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.

    摘要翻译: 一种用于冷却电子部件的灵活的,独立的主动多相散热装置,散热器具有密封在两个板之间的流体和泵送机构以致动流体的多相流动。 来自与散热器接触的电子部件的热能从核心区域经由工作流体散发到整个散热器,然后散热到散热器。 位于两个板之间的表面增强特征有助于将热能从第一金属板传递到流体中。

    Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
    4.
    发明授权
    Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies 失效
    用于单芯片和多芯片组件的整体适配材料制造表面适配盖的方法

    公开(公告)号:US07547582B2

    公开(公告)日:2009-06-16

    申请号:US11535091

    申请日:2006-09-26

    IPC分类号: H01L21/00 H01L23/12 H05K7/20

    摘要: A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.

    摘要翻译: 在单芯片和多芯片模块上具有集成的适配导热材料的表面适配帽提供了减小的间隙公差,因此提高了半导体器件的更好的热性能,从而提高了半导体器件的可靠性。 在其中一个实施例中,盖被整合的,限制的和高热适应性材料修改。 该系统上的膜非常灵活。 在适合材料的固化温度以下的温度下,将盖预先组装到芯片上。 在这种状态下,由于从盖到芯片的压缩和掩埋材料的限制体积,材料中的静水压力会发展。 这种静水压力导致膜偏转并适应芯片的翘曲和公差。 由于自适应表面,芯片和芯片到芯片的每个位置上的间隙是相同的。

    Patterned structure for a thermal interface
    6.
    发明授权
    Patterned structure for a thermal interface 有权
    用于热界面的图案化结构

    公开(公告)号:US08327540B2

    公开(公告)日:2012-12-11

    申请号:US12538797

    申请日:2009-08-10

    IPC分类号: B21D53/02

    摘要: A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.

    摘要翻译: 一种制造具有第一面的板的方法,具有由第一和第二槽限定的突起,包括以下步骤:将凹陷区域蚀刻成板; 在所述板上沉积光致抗蚀剂层; 在光致抗蚀剂层上形成钝化层; 去除凹陷区域底部的钝化层; 电镀金属在凹陷区域; 去除钝化层; 去除光致抗蚀剂层; 以及去除所述半导体材料以暴露所述第一和第二凹槽。

    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
    7.
    发明申请
    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
    用于移动电子系统的冷却泵送系统

    公开(公告)号:US20100044005A1

    公开(公告)日:2010-02-25

    申请号:US12194973

    申请日:2008-08-20

    IPC分类号: B60H1/32

    CPC分类号: H05K7/20272 H05K7/20872

    摘要: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.

    摘要翻译: 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器,流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个,质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。

    PATTERNED STRUCTURE FOR A THERMAL INTERFACE
    8.
    发明申请
    PATTERNED STRUCTURE FOR A THERMAL INTERFACE 有权
    热界面的图案结构

    公开(公告)号:US20100037461A1

    公开(公告)日:2010-02-18

    申请号:US12538797

    申请日:2009-08-10

    IPC分类号: B21D53/02 H01L23/40

    摘要: A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.

    摘要翻译: 一种制造具有第一面的板的方法,具有由第一和第二槽限定的突起,包括以下步骤:将凹陷区域蚀刻成板; 在所述板上沉积光致抗蚀剂层; 在光致抗蚀剂层上形成钝化层; 去除凹陷区域底部的钝化层; 电镀金属在凹陷区域; 去除钝化层; 去除光致抗蚀剂层; 以及去除所述半导体材料以暴露所述第一和第二凹槽。

    SURFACE ADAPTING CAP WITH INTEGRAL ADAPTING MATERIAL FOR SINGLE AND MULTI CHIP MODULE ASSEMBLY
    9.
    发明申请
    SURFACE ADAPTING CAP WITH INTEGRAL ADAPTING MATERIAL FOR SINGLE AND MULTI CHIP MODULE ASSEMBLY 失效
    具有整体适配材料的单面和多芯片模块组装表面处理盖

    公开(公告)号:US20080073775A1

    公开(公告)日:2008-03-27

    申请号:US11535091

    申请日:2006-09-26

    IPC分类号: H01L23/12

    摘要: A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.

    摘要翻译: 在单芯片和多芯片模块上具有集成的适配导热材料的表面适配帽提供了减小的间隙公差,因此提高了半导体器件的更好的热性能,从而提高了半导体器件的可靠性。 在其中一个实施例中,盖被整合的,限制的和高热适应性材料修改。 该系统上的膜非常灵活。 在适合材料的固化温度以下的温度下,将盖预先组装到芯片上。 在这种状态下,由于从盖到芯片的压缩和掩埋材料的限制体积,材料中的静水压力会发展。 这种静水压力导致膜偏转并适应芯片的翘曲和公差。 由于自适应表面,芯片和芯片到芯片的每个位置上的间隙是相同的。

    Patterned structure for a thermal interface
    10.
    发明申请
    Patterned structure for a thermal interface 失效
    用于热界面的图案化结构

    公开(公告)号:US20050263879A1

    公开(公告)日:2005-12-01

    申请号:US11141932

    申请日:2005-06-01

    IPC分类号: H01L23/10 H01L23/42

    摘要: The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.

    摘要翻译: 本发明提供一种通过导热材料彼此接触的第一和第二面的热界面。 第一面包括至少部分地填充有导热材料的凹槽,其中布置至少两种类型的凹槽,即具有比第二凹槽宽的宽度的第一凹槽。 第一面包括具有被第二凹槽限制的突起的阵列,该阵列被第一凹槽划分为子阵列。